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Fostering a Photonics Ecosystem for Sustainable Adoption December 7 - 9 Overview / Summary For the past two decades, integrated photonics has made tremendous progress and is now offered by industry-leading semiconductor companies. However, outside of its most common use in data communications, adoption is still slow and uneven, especially with applications where photonics should have a clear advantage …
Santa Clara Convention Center
5001 Great America Pkwy, Santa Clara, CA, United States
Join us at the TSMC 2022 NA OIP Ecosystem Forum! NA OIP Ecosystem Forum (In-Person Event) Date: October 26, 2022 (Wednesday) Time: 9:00a.m. - 6:30p.m. Venue: Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA 95054 NA OIP Ecosystem Forum (Online VOD Event) Date: November 10, 2022 (Thursday) Website link to be announced in November Learn About: …
Hear researchers from HP Enterprise discuss methodology specifics and design details for a silicon photonics device utilizing 3D-IC technology. TIME: MAY 16, 2023 11 AM EDT / 5 PM CEST Venue: Virtual About this Webinar We’ll highlight a collaborative project with HPE where Ansys HFSS and Ansys Lumerical INTERCONNECT were used with other Ansys tools …
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22 Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile …
Where Money Does Business Money20/20 USA is the world’s biggest, most influential gathering of the global money ecosystem. From in-depth analytics to inspirational speakers, leaders walk away with business-critical insights …
Grand Hyatt Tokyo
6 Chome-10-3 Roppongi, Minato City, Tokyo, Japan
Date: Tuesday, October 24 Time: 9:30a.m. - 6:30p.m. Venue: Grand Hyatt Tokyo 6-10-3, Roppongi, Minato-ku, Tokyo 106-0032 Registration will be closed on 10/16. Seats are limited. VoD (Video on Demand) will be available starting from November 16, 2023 Registration will close on 11/7, 2023. Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for …
Ambassador Hotel Hsinchu
10F, No.188, Sec. 2, Zhonghua Rd., Hsinchu City, Taiwan
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22 Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile …
Semiconductor companies are making transistors smaller and cramming more into chips to meet the demands of today’s high-tech industries and applications. In fact, in a recent article from the Financial Times, technology industry consultants McKinsey forecast that semiconductors will become a trillion-dollar industry by the end of this decade. Even with this massive growth, manufacturers recognize the …
