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TSMC 2023 Taiwan OIP Ecosystem Forum

November 6 @ 9:30 AM - 6:00 PM

TSMC 2023

Learn About:

  • Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22
  • Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications
  • Comprehensive design solutions for specialty technologies enabling ultra-low power, ultra-low voltage, analog migration, RF, mmWave, and automotive designs targeting 5G, automotive, and IoT designs
  • Ecosystem specific TSMC reference flow implementations, P&R optimization, machine learn-ing to improve design quality and productivity, and cloud-based design solutions
  • Successful , real-life applications of design technologies and IP solutions from TSMC’s Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market

TSMC 2023

For more information on the TSMC OIP Ecosystem Forum, e-mail us at: events@pl-marketing.biz.

We look forward to seeing you at the 2023 TSMC OIP Ecosystem Forum!

REGISTER HERE

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Details

Date:
November 6
Time:
9:30 AM - 6:00 PM
Event Tags:
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Website:
https://tsmc-signup.pl-marketing.biz/attendees/2023oip/tw

Organizer

TSMC
View Organizer Website

Venue

Ambassador Hotel Hsinchu
10F, No.188, Sec. 2, Zhonghua Rd.
Hsinchu City, Taiwan
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