Fast Mesh-Free Analysis with Altair SimSolid

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Live Webinar – March 31, 1:00 pm EDT Altair SimSolid is a technological breakthrough enabling civil and structural engineers to analyze fully featured CAD assemblies in minutes, eliminating the time-consuming task of CAD geometry simplification and mesh definition. With SimSolid, design teams can perform multiple iterations of their most complex models and explore alternatives at …

In-Design EM Analysis for Microwave/RF Design and Verification Workflows

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Overview 3D finite element method (FEM) and 3D planar method of moments (MoM) have become a standard design practice for ensuring the accuracy of the overall network simulation. However, without proper setup and use of electromagnetic (EM) analysis tools to define the structure and RF excitation (ports), designers can experience erroneous simulation results and/or excessively …

LIVE WEBINAR: Running CDC Analysis with Xilinx Parameterized Macros (US)

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Abstract: Designing FPGAs that use a single clock domain is a luxury that very few of us have. Modern FPGA designs must cope with multiple clocks running at different frequencies, very often asynchronous to each other, and still be expected to work reliably. Xilinx Parameterized Macros (XPM) can be used to implement CDC, FIFO and …

Cadence TECHTALK: Fast and Easy Rigid and Rigid Board Analysis with the Clarity 3D Solver

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Meeting date: May 31, 2022 Meeting time: 14:00 - 15:00 (Beijing time) Rigid-flex PCBs are used in many modern electronic devices (such as mobile phones, laptops, and wearables, etc.) due to their form factor, light weight, and cost-effectiveness. Due to the complexity of 3D designs, electromagnetic (EM) analysis of rigid-flex PCBs has been a challenging task …

CadenceTECHTALK: Static and Dynamic IR Drop Analysis for Thermal Integrity of High-Performance PCB Designs

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  As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package structures is critical, especially because these resistive losses are also temperature-dependent, making dynamic and static IR drop analysis crucial in addressing the performance and capacity challenges of such designs. …

Constraints-Driven CDC and RDC Verification Including UPF Aware Analysis

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Synopsys Webinar | Thursday, June 23, 2022 | 10:00 - 11:00 a.m. Pacific Today’s million gates integrated circuits (ICs) involve various intellectual properties (IPs) interfacing with each other through multiple asynchronous clock and reset domains. Ensuring all clocks propagate concurrently across each clock tree components used as clock switching elements or each sequential or combinatorial …

Foundations of Semiconductor Power Integrity Analysis and Simulation

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The SEVENTH installment of the Ansys HFSS Foundation webinar series is here! In this webinar, you will gain a deeper understanding of the mathematical underpinnings of Redhawk-SC and its application in Power analysis and Power integrity. July 7, 2022 11 AM EDT / 4 PM BST / 8:30 PM IST Venue: Online About this Webinar …

Webinar: Integrated Thermal Analysis for RF MMIC and PCB Power Applications

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Time: 9:00am - 10:00am (PT) Join us for this one-hour CadenceTECHTALK to learn how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Microwave Office software to provide designers with thermal heat map visualization and operating temperature information. Thermal analysis provides RF circuit designers …

Ansys 2022 R2: What’s New in Safety and Cybersecurity Analysis

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This webinar showcases Ansys medini's many enhancements delivered in Ansys 2022 R2 and shows how you can integrate these features to advance your safety-related activities substantially. TIME: SEPTEMBER 7, 2022 11 AM EDT / 4 PM BST / 8:30 PM IST REGISTER HERE About This Webinar Our A&D customers benefit from improved quantitative fault tree …

CadenceTECHTALK: Preventing EM Failures in IC Designs with Signoff Analysis

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Date: Tuesday, September 20, 2022 Time: 10:00 - 11:00 (CEST) Electromigration (EM) impacts design reliability, causing failures over time. That is why it’s important to analyze both the power mesh and signal wires to check that the average, rms, or peak currents will not lead to a permanent failure. Learn how the Cadence Voltus IC Power …

CadenceTECHTALK: In-Design EM Analysis Addresses RF System Integration Challenges

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Date: Tuesday, September 20, 2022 Time: 10:00am PDT / 1:00pm EDT The RF PA MMIC worked as designed until it was integrated into the module housing, and then the overall performance shifted out of spec. Design failure at the point of system integration is a common cause of delayed product deliveries and engineering cost overruns. …