Loading Events

« All Events

  • This event has passed.

Cadence TECHTALK: Fast and Easy Rigid and Rigid Board Analysis with the Clarity 3D Solver

May 31

cbc4525d450c4a71a66f9269e28f424d b5f5a43024cb219341738fe6ad9f3515

Meeting date: May 31, 2022

Meeting time: 14:00 – 15:00 (Beijing time)

Rigid-flex PCBs are used in many modern electronic devices (such as mobile phones, laptops, and wearables, etc.) due to their form factor, light weight, and cost-effectiveness. Due to the complexity of 3D designs, electromagnetic (EM) analysis of rigid-flex PCBs has been a challenging task for many commercial 3D numerical solver techniques (FEM and FDTD). Much of the complexity comes from bending the board into small spaces and using gridded copper for ground and power planes. In this webinar, we first describe the key challenges facing EM engineers, and then propose a novel automated simulation workflow for a fast-to-market product development process. Our recommended workflow uses Cadence ® Allegro ® PCB Editor and Cadence ®  Clarity™ 3D Solver, the benchmark for design simulation workflows in the PCB-EM community. Compared to other highly manual processes, this process is less error-prone and very effective in setting up electromagnetic simulation designs. Plus, it runs faster than other traditional 3DEM tools in the industry.

Lecturer Information:

Wang Yaofei

Lead Application Engineer

Has six years of experience in product design and EDA. Responsible for the technical promotion and support of the Cadence MSA/Clarity/Sigrity product line, and provide customers with multi-dimensional integrated and customizable enterprise-level EDA simulation and optimization comprehensive solutions in the high-speed, SI, PI and other fields of Chip-Package-Board-System.

REGISTER HERE

Share this post via:

Venue

Online