You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please, join our community today!
March 9, 2022 Overview System planning is a major part of the multi-chiplet design. Whether it’s a 2.5-D configuration with an interposer or full-stacked 3D design mounted on a package, it is important to have an automated way to do bump assignment and optimization along with 3D structures implementation. With methodology evolving for different types …
Overview A 3D-IC includes the package, interposer, multiple chiplets, through-silicon vias (TSVs), and through-dielectric vias (TDVs). Supplying power to the chiplets and dissipating heat through these various components poses a …
Overview Electronics products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise. Addressing these concerns through simulation during system planning and continuing through signoff will accelerate the 3D-IC design cycle by avoiding expensive design re-spins. Therefore, it …
Overview Electronics products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise. Addressing these concerns through simulation during system planning and continuing through signoff will accelerate the 3D-IC design cycle by avoiding expensive design re-spins. Therefore, it …
This webinar outlines the power integrity, thermal integrity, and signal integrity difficulties in 3D-IC design. TIME: NOVEMBER 3, 2022 11 AM EDT / 3 PM GMT / 8:30 PM IST REGISTER HERE About this Webinar This webinar introduces the Multiphysics requirements to meet performance, integrity, and reliability expectations for 3DICs. Beyond ‘golden solver’ requirements for …
In this latest installment of the year-long 3D-IC webinar series, Dr. Lang Lin will discuss the Thermal Integrity issues associated with 3D-IC designs. The presentation will cover thermal hotspots, mechanical stresses induced by thermal issues, and methods for capturing these problems with simulation and virtual prototyping, with a focus on designs that utilize silicon interposers. …
Hear researchers from HP Enterprise discuss methodology specifics and design details for a silicon photonics device utilizing 3D-IC technology. TIME: MAY 16, 2023 11 AM EDT / 5 PM CEST Venue: Virtual About this Webinar We’ll highlight a collaborative project with HPE where Ansys HFSS and Ansys Lumerical INTERCONNECT were used with other Ansys tools …
Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated case and in context with the dice instantiated in a 3D-IC device. The presentation will then explore the completed multi-chip design in a system simulation. …
