Wafer Fab Processing

Munich, Germany

Due to countless breakthroughs and developments in wafer fab processing, today's semiconductor wafer fabrication process contains some of the most intricate procedures developed by humankind. Semitracks' 4-day Wafer Fab Processing course looks in-depth at the semiconductor manufacturing process and individual processing technologies.

$2,095

Semiconductor Reliability and Product Qualification

Munich, Germany

Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability, assessing the impact of …

$2,095

Failure and Yield Analysis

Munich, Germany

Millions of dollars wasted. Lost competitive advantage. Idle manufacturing lines and customer frustrations. These are the all-too-common consequences of semiconductor failures. In today's economy, competent failure analysts are vital to solve these problems before their companies suffer the repercussions. However, as circuits grow more and more complicated, engineers can easily find themselves entangled in a semiconductor …

$2095

7 Tips in 17 Minutes | Leveraging CFD for Electronics

April 21, 2020 11:00 AM (EDT) Venue: Online We're back at it again in our new Ansys Discovery Webinar Series, now sharing CFD knowledge in under 17 minutes! KEY TAKEAWAYS: Understanding design trade-offs through CFD Analysis Seven (7) productive tips you can leverage immediately in a CFDr Workflow Learn how you can perform a simulated …

Increasing Student Engagement in Materials Education Using Ansys GRANTA EduPack

April 21, 2020 11 AM EDT / 3 PM GMT Venue: Online Student engagement is an integral part of teaching. The more ways a student can interact with the course material, the stronger their connection to it. While lectures can be effective for communicating information on any topic to an audience of varying sizes, they …

License-first Scheduling for High-throughput Computing

Saving Serious Money With License-first Scheduling for High-throughput Computing Live Webinar - Tuesday | April 21st | 2pm ET (11am PDT) Make Your Infrastructure Work Harder with License-first Scheduling Computer hardware and software never get tired and never need a lunch break. Ideally you’d like to use them 24/7 - but how can you accomplish …

Optimizing power and increasing data throughput in advanced multi-core AI/ML/DL devices

If you are working on complex Artificial Intelligence (AI) or Machine Learning (ML) or Deep Learning (DL) designs using advanced node processes, you will understand the motivations for optimising CPU utilisation, device power and processing speed. Cutting-edge AI, ML & DL chips, by their very nature, are susceptible to intra-die process variability. Designers are often …

Static Timing Signoff and Model Generation for Complex Analog/Mixed-Signal Designs

Designing complex, mixed-signal IPs is extremely challenging. Traditionally, timing is verified using measurements extracted from dynamic simulations. However, as this is vector-dependent, it relies heavily on designer expertise to select the correct set of critical paths. Often, this approach does not cover all the necessary timing checks across all operational modes and process corners. Failing …

IP Integration Challenges of Complex SoC Platforms

The explosion of AI and pervasive intelligence has created an exponential demand for increasing compute power, best addressed using GPUs (Graphics Processing Unit) and FPGAs (Field Programmable Gate Arrays). This is accomplished by providing a HW platform that runs computationally intensive machine learning algorithms fast and efficiently. That said, both GPU and FPGA vendors have …

IC Packaging Technology

Munich, Germany

Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: (1) pitch conversion between the fine features of the IC die and …

$1,195

Red Hat Summit

RESCHEDULED From here, anywhere Red Hat Summit 2020 Virtual Experience April 28-29 Immerse yourself in our free virtual event and find your inspiration at the intersection of choice and potential. Register …

Improving Converter Circuit Efficiency with Transient Simulation of Power Transistors During Circuit Operation

High performance power transistors are used in power management ICs, where switching behavior is extremely important. However, due to their large distributed gate and active area structure, accurately simulating switching …