Welcome to the two (2) day, 13th Annual Hybrid Riscure workshop on September 3 & 4th 2020. The event is will focus on topics relevant to embedded security. The delivery …
Continue reading "Riscure Hybrid Workshop 2020 – Embedded Security via Webcasting & Offline"
Promoting EUV Lithography via Workshops, Consulting & Education Introducing the EUVL Supplier Showcase: an Amazing Way to Learn Directly from Suppliers about the Newest and Best Products and Services for …
To achieve maximal QoR, Broadcom wanted to take advantage of all the advanced optimizations that Design Compiler offers. These optimizations, however, are of little value if they cannot be verified …
Continue reading "Best Verifiable QoR – A Formal Equivalence Checking Yardstick"
Join us for the ARC® Processor Virtual Summit to hear our experts, users and ecosystem partners discuss the most recent trends and product developments in ARC-based processor solutions. This multi-day …
Synopsys Is About to Unveil a New Era of Photonic Chip Design On September 9, Synopsys will introduce its industry-first unified software platform for photonic IC design. Register to attend …
Why IP SoC China 20? China is the largest and fastest growing semiconductor market in the world and at the same time, the semiconductor world has to face a worldwide …
Continue reading "IP SoC China 20 September 15th, 2020 A virtual Event"
Pioneer of Online conference in Semiconductor Industry VSDOpen 2020 is the only online conference to showcase Semiconductor IP’s designed by University Students using Open source resources VSDOpen offers education, research …
Webinar Overview With recent advances in packaging technology it is possible to connect multiple dies on a single package. OpenFive’s D2D Controller provides end to end connection from one die …
Continue reading "WEBINAR: Protocol Agnostic Die-to-Die Connectivity for Chiplets and HPC"
This period of pandemic and confinement has fostered telework and remote relationships. As a result, data transfers around the world have increased dramatically. During its annual Devices Workshop, CEA-Leti will …
System-in-package (SiP) designs for high-performance computing (HPC), high-speed networking, and AI applications are extremely complex. To achieve maximum performance without exceeding tight thermal and power constraints, these chips must be …
Continue reading "Electrothermal Signoff for 2.5D and 3D-IC Systems"
Overview: Join this webinar to learn how Visual Design Diff helps analog/mixed-signal designers using the Cadence Virtuoso platform to manage ECO’s & conduct design reviews more efficiently. VDD gives design …
Continue reading "For Cadence Virtuoso Users : Manage ECOs and Design Reviews Efficiently"
Semiconductor Women's Forum Description The event will be the inaugural Semiconductor Women’s Forum in Singapore. With the theme Beyond Recovery: Leadership For A More Inclusive And Resilient World, it aims …
