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WEBINAR: Protocol Agnostic Die-to-Die Connectivity for Chiplets and HPC
October 22, 2020 @ 9:00 AM - 10:00 AM
Webinar Overview
With recent advances in packaging technology it is possible to connect multiple dies on a single package. OpenFive’s D2D Controller provides end to end connection from one die to another. In this webinar we will review trade-offs between various connectivity options. We will also review the application of D2D in Chiplets and HPC to meet designer’s latency and power targets. D2D is increasingly finding use cases to meet designers latency and power targets.
Key Learnings:
Die-to-Die connectivity, various package options
Who should attend?:
Designers, Architects, Marketing, Package engineers
Speaker
Ketan Mehta
Sr. Director of SoC IP Product Marketing
As the Director of SoC IP Product Marketing at SiFive, Ketan Mehta is responsible for Interlaken, Ethernet, HBM memory and other high-speed interfaces. With over 25 years of experience in engineering and product planning, Ketan has a rich background in IP connectivity solutions for various applications including networking, storage, data center and cloud. He received his M.S. degree in electrical engineering from The University of Texas at San Antonio, and his MBA from San Jose State University.
About OpenFive
OpenFive is a solution-centric silicon company that is uniquely positioned to design processor agnostic SoC architectures.
With customizable and differentiated IP for Artificial Intelligence, Edge Computing, HPC, and Networking solutions, OpenFive develops domain-specific SoC architectures based on high-performance, highly-efficient, cost-optimized IP to deliver scalable, optimized, differentiated silicon.
IP Lifecycle Management for Chiplet-Based SoCs