Photonics Contribution to High-Performance Computing

Photons light the way for high-performance computing 

Driven by the exponential growth in data and the need for high performance with low power, photonics is becoming a disrupting force in high-performance computing (HPC) architectures. The unique properties of light make it possible to create innovative low-power processing chiplets. However, these need to be connected to traditional electronics systems to realize their true potential.

Join Cadence for the fifth annual CadenceCONNECT: Photonics Contribution for High-Performance Computing, December 1-3, to learn from industry and academic experts how photonics can advance the next generation of HPC. We’ll be covering device interaction on Day 1, optical accelerators on Day 2, and connecting to systems on Day 3.

Who should attend? 

• Photonics and electro-photonics designers and architects
• Photonics design project leads
• Photonics design managers
• CAD and PDK managers

Agenda Subject to Change

December 1

Morning Session: 8:00am – 11:00 PST
Afternoon Session: 5:00pm – 8:00pm PST (Repeat of AM session)

• Keynote Speaker:  Photonic Integration – From Switching to Computing, Odile Liboiron-Ladouceur, Ph.D, McGill University
• Programming General-Purpose Photonic Processors, Daniel Pérez López, Ph.D, iPronics
• The Transition to Chip-to-Chip Optical I/O, Dr. Mark Wades, Ph.D, Ayar Labs
• Embedding Photonics into DRAM – Motivation, Lessons, and Leftovers, DongJae Shin, Ph.D, Samsung Advanced Institute of Technology

December 2

Morning Session: 8:00am – 11:00am PST

Afternoon Session: 5:00pm – 8:00pm PST (Repeat of AM session)

• Near-Term Photonic Quantum Computing on the Cloud, Zach Vernon, Ph.D, Xanadu
• Quantum Integrated Photonics, Michael Fanto, Ph.D, AFRL
• Design and Simulation of Quantum Photonic Circuits, James Pond, Ph.D, ANSYS
• Analog Optical Accelerators for Neuromorphic Computing, Bert Jan Offrein, Ph.D, IBM

December 3

Morning Session: 8:00am – 11:30am PST

Afternoon Session: 5:00pm – 8:00pm PST (Repeat of AM session)

• Efficient Assembly and Packaging for Photonics, Alexander Janta-Polczynski, IBM
• Photonic Wirebonds for Silicon Photonics: Early Results From SiEPICfab, Lukas Chrostowski, Ph.D, University of British Columbia
• Rochester Test Assembly Packaging Facility for Photonics Systems – Research Project Update, Ed White, AIM
• Foundations For Scalable Chip-to-Chip Connectivity, Hesham Taha, Ph.D, Teramount Ltd.
• Panel Q&A