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Electronics cooling – accelerated
May 12, 2020 @ 10:00 AM - 11:00 AM
Big challenge of electronics cooling is the geometry complexity we deal with.
In this webinar we demonstrate a number of new features that makes it faster and easier to setup simulations in ANSYS ICEPAK. This is especially true for more complex geometries.
Come and learn the latest tips and tricks for ICEPAK meshing.