Power integrity and reliability are just as important for AMS designs as they are for digital designs. Ansys is offering a series of five webinars on this topic, under a heading they call ANSYS in ACTION, a bi-weekly demo series from ANSYS in which an application engineer shows you how simulation can address common applications. Schedule a few 20-minute breaks to see how Ansys can solve your problems.
You can REGISTER HERE for any or all of these webinars.
November 16[SUP]th[/SUP] 2017 at 10AM PST The first webinar in the series is on Analog and Mixed Signal Workflows for Power and Reliability Signoff for SerDes IP and PMIC. Analog and mixed signal IPs are very complex and require significant time to design, verify and validate. With increasing mask costs and tighter design cycles, first time silicon success is key to accelerate time to market and beat the competition. Join us for this 20-minute webinar to learn how AMS workflows based on ANSYS Totem, a layout-based transistor level power and reliability signoff platform, can enable you to design the next generation of SerDes IP or PMIC for cutting-edge applications.
November 30[SUP]th[/SUP] 2017 at 10AM PST The second webinar in the series is on Enabling Early Power and Reliability Analysis for AMS Designs. Attend this webinar to discover the benefits of doing early power and reliability analysis with just a GDS layout. This presentation will demonstrate early IP level connectivity checks; missing via checks; point to point resistance and short path resistance checks; and early static analysis to identify structural design weaknesses using ANSYS Totem’s rich GUI interface.
December 7[SUP]th[/SUP] 2017 at 10AM PST The third webinar in the series is on Enabling Power and Reliability Signoff for AMS Designs. Attend this webinar to learn how ANSYS Totem can model and simulate the required power and reliability signoff checks for AMS designs. This presentation will demonstrate the benefits of using Totem to perform dynamic voltage drop and EM checks through its rich GUI interface, which can also be leveraged for debugging purposes.
December 14[SUP]th[/SUP] 2017 at 10AM PST The fourth webinar in the series is on Enabling FinFET Thermal Reliability Signoff for IPs. ANSYS Totem can solve the challenges faced by engineers trying to ensure thermal and electromigration (EM) reliability in advanced IPs. Join this webinar to see a demonstration of self-heat analysis on an IP test case using ANSYS Totem’s rich GUI interface. The demonstration will cover flow setup, debugging and result exploration for reliability signoff.
January 11[SUP]th[/SUP] 2018 at 10AM PST The fifth webinar in the series is on Enabling ESD Reliability Signoff for AMS IPs. Attend this webinar to discover how ANSYS PathFinder can help you solve the challenges you face in trying to ensure ESD robustness in today’s AMS IPs. Watch a live demonstration of ANSYS PathFinder on an IP-level test case to highlight the benefits of a layout-based ESD integrity solution for resistance and current density checks.
REGISTER HERE for any or all of these webinars.
If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge, or put on wearable technology, chances are you’ve used a product where ANSYS software played a critical role in its creation. ANSYS is the global leader in engineering simulation. We help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and engineer products limited only by imagination.