Optimizing high performance packages calls for multidisciplinary 3D modeling

Optimizing high performance packages calls for multidisciplinary 3D modeling
by Tom Simon on 10-16-2019 at 10:00 am

For all the time we spend thinking and talking about silicon design, it’s easy to forget just how important package design is. Semiconductor packages have evolved over the years from very basic containers for ICs into very specialized and highly engineered elements of finished electronic systems. They play an important role … Read More


Safety Methods Meet Enterprise SSDs

Safety Methods Meet Enterprise SSDs
by Bernard Murphy on 07-16-2019 at 5:00 am

The use of safety-centric logic design techniques for automotive applications is now widely appreciated, but did you know that similar methods are gaining traction in the design of enterprise-level SSD controllers? In the never-ending optimization of datacenters, a lot attention is being paid to smart storage, offloading… Read More


Accelerating SOC Development for Automobile Applications

Accelerating SOC Development for Automobile Applications
by Tom Simon on 03-11-2019 at 12:00 pm

No area of electronics is moving faster than automotive semiconductors. Everyone has been talking about the increasing electronics content of automobiles for decades. With Advanced Driver Assistance System (ADAS) and autonomous driving becoming a reality the pace has picked up even more. These new designs combine just about… Read More


Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design

Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design
by Camille Kokozaki on 02-14-2019 at 7:00 am

In an ANSYS seminar held at DesignCon 2019, Dr. Larry Williams, ANSYS Director of Technology, outlined how 5G design innovation can be accelerated through simulation. He posited that 5G will become a general-purpose technology that affects an entire economy, drastically alter societies and unleash a cascade of complementary… Read More


Mentor’s Busy ITC and Major Test Product Updates

Mentor’s Busy ITC and Major Test Product Updates
by Tom Simon on 10-31-2018 at 1:00 pm

In conjunction with the 2018 International Test Conference, Mentor has several interesting test announcements. They also have a busy round of technical activities, including a number of technical papers, presentations, tutorials and a poster from a major customer about using Mentor. I’d like to touch on the two product related… Read More


Mesh Networks, Redux

Mesh Networks, Redux
by Bernard Murphy on 09-27-2018 at 7:00 am

It isn’t hard to understand the advantage of mesh networking (in wireless networks). Unlike star/tree configurations in which end-points connect to a nearby hub (such as phones connecting to a conventional wireless access point), in a mesh nodes can connect to nearest neighbors, which can connect to their nearest neighbors… Read More


Integrity, Reliability Shift Left with ICC

Integrity, Reliability Shift Left with ICC
by Bernard Murphy on 06-26-2018 at 7:00 am

There is a nice serendipity in discovering that two companies I cover are working together. Good for them naturally but makes my job easier because I already have a good idea about the benefits of the partnership. Synopsys and ANSYS announced a collaboration at DAC 2017 for accelerating design optimization for HPS, mobile and automotive.… Read More


John Lee: Market Trends, Raising the Bar on Signoff

John Lee: Market Trends, Raising the Bar on Signoff
by Bernard Murphy on 06-07-2018 at 7:00 am

I talked to John Lee (GM of the ANSYS Semiconductor BU) recently about his views on market trends and the ANSYS big-picture theme for DAC 2018. He set the stage by saying he really liked Wally’s view on trends (see my blog on Wally’s keynote at U2U). John said these confirm what he is seeing – a trend to specialization, some around… Read More


Webinar: Thermal and Reliability for ADAS and Autonomy

Webinar: Thermal and Reliability for ADAS and Autonomy
by Bernard Murphy on 05-15-2018 at 7:00 am

OK, so maybe the picture here is a little over the top, but thermal and reliability considerations in automotive in general and in ADAS and autonomy in particular, are no joke. Overheating, thermal-induced EM and warping at the board-level, in the package or interposers, are concerns in any environment but especially when you’… Read More


Stress and Aging

Stress and Aging
by Bernard Murphy on 04-05-2018 at 12:00 pm

These failings aren’t just a cross we humans bear; they’re also a concern for chips, particularly in electrical over-stress (EOS) and aging of the circuitry. Such concerns are not new, but they are taking on new urgency given the high reliability and long lifetime expectations we have for safety-critical components in cars and… Read More