ANSYS and Apache are putting on a new series of seminars about designing future electronic systems. These are only getting more complex, of course, cramming more and more functionality into smaller portable devices with good battery life (and not getting too hot), integrating multiple antennas into a single platform, and TSV-based 2.5D and 3D designs.
If you attend the seminar you will get technology updates on ANSYS HFSS (the industry standard for 3D full-wave electromagnetic field simulation), Apache RedHawk, and ANSYS SIwave (for complete channel analysis of PCB and IC packages). You can see from this list that more and more the Apache and ANSYS products are being used together for complex analysis. The seminar will also discuss future integration of ANSYS and Apache products that will revolutionize Chip-Package-Sytstem (CPS) design. Each seminar also will have real designers sharing their experience as to how to meet all the Ps for their design: power, performance, price.
The seminars are free to qualified attendeed. However, seating is limited so you must sign up in advance. The registration page is here.
There are four seminars currently scheduled:
- Thursday October 11th at Sheraton Framingham MA. Detailed agenda.
- Thursday October 18th at Hyatt Regency Santa Clara CA. Detailed agenda.
- Wednesday October 24th at Manhattan Beach Marriott CA. Detailed agenda.
- Thursday November 1st at Hyatt Regency Austin TX. Detailed agenda.