Power Integrity from 3DIC to Board

Power Integrity from 3DIC to Board
by Bernard Murphy on 09-14-2017 at 7:00 am

The semiconductor industry has built decades of success on hyper-integration to increase functionality and performance while also reducing system cost. But the standard way to do this, to jam more and more functionality onto a single die, breaks down when some of the functions you want to integrate are built in different processes.… Read More


Why using new DDR4 allow designing incredibly more efficient Server/Storage applications?

Why using new DDR4 allow designing incredibly more efficient Server/Storage applications?
by Eric Esteve on 08-04-2016 at 12:00 pm

The old one-size-fits-all approach doesn’t work anymore for DDR4 memory controller IP, especially when addressing the enterprise segments, or application like servers, storage and networking. For mobile or high end consumer segments, we can easily identify two key factors: price (memory amount or controller footprint) … Read More


“Thinking Outside the Chip”

“Thinking Outside the Chip”
by Students@olemiss.edu on 04-13-2016 at 7:00 am

Image RemovedWhile pushing Moore’s Law’s boundaries in the world of 2D packaging, companies are starting to explore nontraditional approaches towards designing integrated circuit chips. 2D packaging is currently the most used method in designing chips in the industry, and while it leads in efficiency of power and performance,… Read More


2.5D supply chain takes HBM over the wall

2.5D supply chain takes HBM over the wall
by Don Dingee on 04-11-2016 at 4:00 pm

SoC designers have hit the memory wall head on. Although most SoCs address a relatively small memory capacity compared with PC and server chips, memory power consumption and bandwidth are struggling to keep up with processing and content expectations. A recent webinar looks at HBM as a possible solution.… Read More


Fabless vs IDM for Data Centers: Silicon Photonics as a Disruptive Force?

Fabless vs IDM for Data Centers: Silicon Photonics as a Disruptive Force?
by Mitch Heins on 04-07-2016 at 7:00 am

Image RemovedI recently received a copy of a book entitled Silicon Photonics III (Amazon) and while perusing the book I was captured by the first chapter entitled ‘Silicon Optical Interposers for High-Density Optical Interconnects’. The chapter covered the work of a team in Japan on an idea they termed “on-chip servers” and “on-boa… Read More


How HBM Will Change SOC Design

How HBM Will Change SOC Design
by Tom Simon on 03-19-2016 at 7:00 am

High Bandwidth Memory (HBM) promises to do for electronic product design what high-rise buildings did for cities. Up until now, electronic circuits have suffered from the equivalent of suburban sprawl. HBM is a radical transformation of memory architecture that will have huge ripple effects on how SOC based electronics are … Read More


2015 3D ASIP conference: Thar’s Gold in Them Thar Hills!

2015 3D ASIP conference: Thar’s Gold in Them Thar Hills!
by Bill Martin on 12-27-2015 at 4:00 pm

Image RemovedLast week I presented at the 3D ASIP EDA Tutorial and attended the Conference. In previous years, leading edge papers were presented from large companies pushing a solution to meet their needs. These companies had the resources and clout to achieve some astounding successes, but the lingering question was: “wh… Read More


ASMC 2015 Preview

ASMC 2015 Preview
by Scotten Jones on 05-01-2015 at 7:00 am

Image RemovedFrom May 3[SUP]rd[/SUP] to May 6[SUP]th[/SUP] the 26[SUP]th[/SUP] annual Advanced Semiconductor Manufacturing Conference (ASMC) will be held in Saratoga Springs, New York.

The ASMC offers a unique view of challenges to the semiconductor industry focusing on things like defect reduction, metrology and fab … Read More


TSV Modeling Key for Next Generation SOC Module Performance

TSV Modeling Key for Next Generation SOC Module Performance
by Tom Simon on 04-20-2015 at 1:00 pm

The use of silicon interposers is growing. Several years ago Xilinx broke new ground by employing interposers in their Virtex®-7 H580T FPGA. Last August Samsung announced what they say is the first DDR4 module to use 3D TSV’s for enterprise servers. Their 64GB double data rate-4 modules will be used for high end computing where … Read More


Will 3DIC Ever Be Cheap Enough for High Volume Products?

Will 3DIC Ever Be Cheap Enough for High Volume Products?
by Paul McLellan on 12-12-2014 at 8:00 pm

Image RemovedMore news from the 3DASIP conference. Chet Palesko of SavanSys Solution had an interesting presentation with the same title as this blog (although this blog draws from several other presentations too). Chet took a look at what aspects of 3D are likely to get cheaper going forward. He took as a starting point that stuff… Read More