On-Chip Power Integrity Analysis Moves to the Package

On-Chip Power Integrity Analysis Moves to the Package
by Tom Simon on 03-11-2015 at 1:00 am

Power regimes for contemporary SOC’s now include a large number of voltage domains. Rail voltages are matched closely to the performance and power requirements of various portions of the design. Indeed, some of the supply voltages are so low that the noise margins in these domains is exceedingly low. Higher voltage domains are… Read More


ANSYS Talks About Multi Physics for Thermal Analysis at DesignCon

ANSYS Talks About Multi Physics for Thermal Analysis at DesignCon
by Tom Simon on 01-27-2015 at 9:00 am

ANSYS makes a big deal of being a multi-physics company. Still it has taken them a while to fully integrate Apache. Nevertheless it seems like there is a compelling argument for combining technologies to solve SOC design problems. Frankly most chip designers would be hard pressed to think of a reason for using computational fluidRead More


FinFET Design for Power, Noise and Reliability

FinFET Design for Power, Noise and Reliability
by Daniel Payne on 08-29-2014 at 4:00 pm

IC designers have been running analysis tools for power, noise and reliability for many years now, so what is new when you start using FinFET transistors instead of planar transistors? Calvin Chow from ANSYS (Apache Design) presented on this topic earlier in the summer through a 33 minutewebinar that has been archived. There is… Read More


Know All About ESD and Save Your Chips & Systems

Know All About ESD and Save Your Chips & Systems
by Pawan Fangaria on 08-24-2014 at 7:30 pm

In this age of electronics, especially with so many different types of human held devices and more upcoming wearable devices, it’s utmost important to protect the massive circuitry inside those tiny parts in the devices from ESD related failures. The protection needs to happen at all stages – cells inside the chips, package… Read More


Paving the Path for Robust Electronic System Design

Paving the Path for Robust Electronic System Design
by Pawan Fangaria on 07-13-2014 at 7:30 pm

In today’s era of low power and high performance components, preferably on a single chip provides impetus to much larger electronic systems packaged into much smaller cases; smartphones are the immediate examples which encapsulate multiple functions other than the intended ones, viz. phone and data communication. As an example,… Read More


Noise-Coupled Analysis for Automotive ICs at DAC

Noise-Coupled Analysis for Automotive ICs at DAC
by Daniel Payne on 06-20-2014 at 2:00 pm

My favorite method to learn about EDA tools at DACis by listening to actual IC designers, so on June 3rd I heard Jacob Bakker from NXP talk about his experience with noise coupled analysis for advanced mixed-signal automotive ICs.… Read More


FinFET Based Designs Made Easy & Reliable

FinFET Based Designs Made Easy & Reliable
by Pawan Fangaria on 06-15-2014 at 11:00 am

Although semiconductor manufacturing has taken off with FinFET based process technology which provides lucrative payoffs on performance improvement, power reduction and area saving in devices for high density and high performance SoC demand of modern era, apprehensions remain about its reliability due to reduced noise … Read More


RedHawk Excels – Customers Endorse

RedHawk Excels – Customers Endorse
by Pawan Fangaria on 05-28-2014 at 11:00 am

Since a few years, I have been following up Ansys Apachetools for semiconductor design, verification and sign-off. RedHawk is the most prominent platform of tools from Ansys, specifically for Power, Noise and Reliability Sign-off. It has witnessed many open endorsements from several of Ansyscustomers through open presentations,… Read More


LSI’s Way of Faster & Reliable Electronic System Design

LSI’s Way of Faster & Reliable Electronic System Design
by Pawan Fangaria on 05-05-2014 at 9:30 am

LSI Corporationstarted in 1980s and I had several encounters with it during my jobs in 1990s; not to forget the LSI chips I used to see in desktops and other electronic systems, and I’m happy to see LSI continuing today with more vigour having leadership position in storage and networking space. It provides highly reliable, high … Read More


Fast & Accurate Thermal Analysis of 3D-ICs

Fast & Accurate Thermal Analysis of 3D-ICs
by Pawan Fangaria on 04-14-2014 at 11:00 am

As Moore’s law started saturating on a single semiconductor die, the semiconductor community came up with the approach of growing vertically by stacking dies one above other in a 3D-IC arrangement. However, a major concern with a 3D-IC is that the heat generated by each die can get trapped in the stack, and hence it’s extremely important… Read More