Synopsys-Ansys 2.5D/3D Multi-Die Design Update: Learning from the Early Adopters

The demand for high-performance computing (HPC), data centers, and AI-driven applications has fueled the rise of 2.5D and 3D multi-die designs, offering superior performance, power efficiency, and packaging density. However, these benefits come with myriads of challenges, such as multi-physics, which need to be addressed. Ansys and Synopsys as part of their long-standing partnership are addressing these multi-die design challenges, bringing together cutting-edge technology and solutions to enhance the multi-die design and verification process from early architecture to manufacturing and reliability

Multi-Die Design Challenges: Architecture and Early Prototyping

Multi-die designs are far more complex than traditional monolithic chip designs. The integration of multiple heterogeneous and homogeneous dies within a single package leads to significant challenges, particularly in thermal management, mechanical stress, and early architecture decisions. The initial architecture and die placement are major steps in the multi-die design process, requiring specialized tools. Synopsys 3DIC Compiler™ is an industry-leading solution that helps define the architecture of 2.5D/3D multi-die designs in a unified exploration-to-signoff platform. It enables chip designers to address early architectural challenges effectively, facilitating smoother transitions into early prototyping and ultimately to signoff.

Thermal awareness and mechanical reliability are major challenges that should be addressed as early as possible in the design cycle. Thermal challenges in multi-die designs can arise from temperature and thermal property differences between individual dies, die interconnects, and materials used in multi-die designs. Designers must thoroughly analyze each element to avoid costly redesigns later. Mechanical issues like stress and warpage can lead to failures if not addressed early in the design process. Ansys offers a comprehensive platform for tackling these physical challenges at an early stage. With software tools like Ansys RedHawk-SC Electrothermal™ and Ansys Icepak™, designers can efficiently address these issues to facilitate rapid prototyping and architectural exploration. Early-stage thermal and mechanical analysis is critical to prevent problems like hotspots, warping, and system failures due to poor heat dissipation or physical stress.

Importance of Early Verification

Verification at an early stage of multi-die design is pivotal. As multiple dies are stacked together in a small form factor, verifying the overall system becomes increasingly difficult, yet even more essential. Failure to catch potential issues early, such as thermal bottlenecks or power integrity problems, could lead to costly delays and suboptimal performance.

One of the key challenges in multi-die design is managing voltage drop and electromigration (EM/IR), which can lead to power integrity failures. Especially difficult is ensuring reliable power distribution in the vertical direction from interposer to chip, and between stacked chips. Supply currents for up to 200W need to be delivered through tiny microbumps, hybrid bonds, and through-silicon vias (TSVs). This requires very careful power integrity analysis down to level of each individual bump.

Ansys RedHawk-SC Electrothermal offers advanced simulation capabilities for robust power integrity analysis while Synopsys 3DIC Compiler ensures that the design architecture meets the desired design goals by enabling feasibility and prototyping, and implementation and analysis, all in a single environment using a common data model. Under our existing partnership, Ansys and Synopsys provide designers with the necessary solutions to create resilient 2.5D/3D multi-die designs that can withstand the demands of modern high-performance computing environments.

The Role of AI in Multi-Die Designs

Artificial Intelligence (AI) is revolutionizing how designers’ approach 3DIC designs. AI-driven tools can automate many time-consuming processes, from early prototyping to layout optimization, significantly reducing the design cycle. As the complexity of multi-die design continues to grow, AI technology will become an essential component in handling massive design datasets, enabling smarter decisions and faster results.

The use of AI in design exploration can help optimize key parameters such as power efficiency, thermal distribution, and interconnect layout. This is not just a matter of saving time; AI’s ability to predict and automate design solutions can lead to more innovative and efficient architectures, allowing designers to focus on higher-level innovations.

The Golden Sign-off Tools

Ansys RedHawk-SC and Synopsys PrimeTime stand as first-class tools for signoff verification. Together, these tools provide designers with a robust verification framework, ensuring that the multi-die designs not only meet performance and power targets but also maintain reliability and longevity.

As multi-die design continues to evolve, the long-standing partnership between Ansys and Synopsys is leading the way in helping designers overcome the inherent complexities of multi-die  design. To learn more about the latest advances in this area,  attend the joint Ansys and Synopsys webinar by registering at “Technology Update: The Latest Advances in Multi-Die Design“ to explore multi-die designs, key challenges, and how Synopsys and Ansys software solutions can help you overcome these obstacles. Learn how these tools can streamline the 2.5D/3D multi-die design process, enabling more efficient and effective designs.

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