A Practical Approach to Better Thermal Analysis for Chip and Package

A Practical Approach to Better Thermal Analysis for Chip and Package
by Daniel Nenni on 12-13-2021 at 6:00 am

ANSYS Thermal Chip Model

Thermal modeling has become a hot topic for designers of today’s high-speed circuits and complex packages. This has led to the adoption of better and more sophisticated thermal modeling tools and flows as exemplified in this presentation by Micron at the IDEAS Digital Forum. The presentation is titled “Thermal Aware Memory ControllerRead More


TSMC OIP DAC Theater Schedule 2018

TSMC OIP DAC Theater Schedule 2018
by Daniel Nenni on 06-20-2018 at 6:00 am

The TSMC OIP DAC Theater schedule is finalized and ready to go. It kicks off Monday at 10:15 am in booth #1629 and ends with a raffle at 5:45 pm each day (Mon-Tue-Wed) TSMC gives out some very nice prizes so check in with the TSMC booth staff when you arrive. There are 66 coveted presentation spots representing the top ecosystem partners… Read More