For ASIC design teams, the gap between RTL simulation and first silicon remains one of the most consequential stages of the development cycle. Simulation provides controllability and visibility, but it cannot always reproduce the software workloads, interface behavior, clock interactions, and sustained system activity… Read More
Join us for our 6th Annual Virtual Prototyping Day and learn how you can “shift left” your development cycle with virtual prototypes.
Highly complex SoC and muti-die designs are putting pressure on silicon and software development teams to meet time-to-market demands. Virtual prototypes are the answer to begin… Read More
The semiconductor industry is entering a new era in system design. As traditional monolithic scaling approaches its economic and physical limits, multi-die architectures are emerging as a primary pathway for delivering continued improvements in performance, power efficiency, and integration density. By distributing … Read More
System-on-Chip designs continue to grow in scale and interface diversity, placing greater demands on prototype capacity, interconnect planning, and bring-up efficiency. These challenges arise not only in large multi-FPGA programs but also in smaller designs implemented on a single device or a small FPGA cluster. In all cases,… Read More
Last week, Synopsys announced an expansion of their Hardware-Assisted Verification (HAV) portfolio to accelerate semiconductor design innovations. These advancements are designed to meet the increasing demands of semiconductor complexity, enabling faster and more efficient verification across software and hardware… Read More
The demand for high-performance computing (HPC), data centers, and AI-driven applications has fueled the rise of 2.5D and 3D multi-die designs, offering superior performance, power efficiency, and packaging density. However, these benefits come with myriads of challenges, such as multi-physics, which need to be addressed.… Read More
In today’s rapidly advancing technological landscape, semiconductors are at the heart of innovation across diverse industries such as automotive, healthcare, telecommunications, and consumer electronics. As a leader in technology and engineering, Siemens plays a pivotal role in empowering the next generation … Read More
I am a fan of product releases which bundle together multiple high-value advances. That approach reduces the frequency of releases (no bad thing) in exchange for more to offer per release, better proven through solid partner validation. The Dynamic Duo III release falls in this class, offering improvements in performance, capacity,… Read More
Artificial Intelligence is now the primary driver of leading edge semiconductor technology and that means performance is at a premium and time to market will be measured in billions of dollars of revenue. Emulation and Prototyping have never been more important and we are seeing some amazing technology breakthroughs including… Read More
S2C has been shipping FPGA prototyping platforms for SoC verification for almost two decades, and many of its customers are developing SoCs and silicon IP for Bluetooth applications. Prototyping Bluetooth designs before silicon has yielded improved design efficiencies through more comprehensive system validation, and… Read More
