WP_Term Object
(
    [term_id] => 44
    [name] => TechInsights
    [slug] => techinsights
    [term_group] => 0
    [term_taxonomy_id] => 44
    [taxonomy] => category
    [description] => 
    [parent] => 386
    [count] => 105
    [filter] => raw
    [cat_ID] => 44
    [category_count] => 105
    [category_description] => 
    [cat_name] => TechInsights
    [category_nicename] => techinsights
    [category_parent] => 386
    [is_post] => 
)
            
image001 (16)
WP_Term Object
(
    [term_id] => 44
    [name] => TechInsights
    [slug] => techinsights
    [term_group] => 0
    [term_taxonomy_id] => 44
    [taxonomy] => category
    [description] => 
    [parent] => 386
    [count] => 105
    [filter] => raw
    [cat_ID] => 44
    [category_count] => 105
    [category_description] => 
    [cat_name] => TechInsights
    [category_nicename] => techinsights
    [category_parent] => 386
    [is_post] => 
)

IEDM 2019 – Imec Interviews

IEDM 2019 – Imec Interviews
by Scotten Jones on 01-21-2020 at 6:00 am

Slide4

Imec is one of the premier semiconductor research organizations and at IEDM they presented dozens of papers. I had the opportunity to see several of the papers presented and interview 3 of Imec’s researchers.

Jan Van Houdt, DMTS ferroelectric and exploratory memory

I have had very interesting discussions with Imec researchers… Read More


IEDM 2019 – IBM and Leti

IEDM 2019 – IBM and Leti
by Scotten Jones on 01-08-2020 at 6:00 am

Slide3

IBM and Leti each presented several papers at IEDM including a joint nanosheet paper. I had the opportunity to sit down with Huiming Bu, director of advanced logic & memory tech and Veeraraghavan Basker, senior engineer from IBM and then in a separate interview Francois Andrieu, head of advanced CMOS laboratory and Shay Reboh,… Read More


IEDM 2019 – Applied Materials panel EUV Recap

IEDM 2019 – Applied Materials panel EUV Recap
by Scotten Jones on 12-23-2019 at 10:00 am

On Tuesday night of IEDM, Applied Materials held a panel discussion “The Future of Logic: EUV is Here, Now What?”. The panelists were: Regina Freed, managing director at Applied Materials as the moderator, Geoffrey Yeap, senior director of advanced technology at TSMC, Bala Haran, director of silicon process research at IBM, … Read More


300mm Fab Watch 2019!

300mm Fab Watch 2019!
by Daniel Nenni on 08-09-2019 at 10:00 am

Unless you are new to SemiWiki you should be familiar with Scotten Jones, founder of IC Knowledge, semiconductor process expert, and blogger extraordinaire. Scott joined SemiWiki in 2014 and has been blogging ever since with 130 posted thus far.

Scott’s, company, IC Knowledge LLC, is the world leader in cost modeling of… Read More


Semicon West 2019 – Day 2

Semicon West 2019 – Day 2
by Scotten Jones on 07-18-2019 at 10:00 am

Tuesday July 9th was the first day the show floor was open at Semicon. The following is a summary of some announcements I attended and general observations.

AMAT Announcement

My day started with an Applied Materials (AMAT) briefing for press and analysts where they announced “the most sophisticated system they have ever released”.… Read More


SPIE Advanced Lithography Conference – Imec design papers

SPIE Advanced Lithography Conference – Imec design papers
by Scotten Jones on 06-27-2019 at 10:00 am

At the SPIE Advanced Lithography Conference Imec presented several design papers and I have had the opportunity to review the papers and speak with the authors. In this summary I am going to address three emerging areas in order of when I think they may be implemented from soonest to latest.

Specifically, I will discuss:

  1. Buried Power
Read More

TSMC and Samsung 5nm Comparison

TSMC and Samsung 5nm Comparison
by Scotten Jones on 05-03-2019 at 7:00 am

Samsung and TSMC have both made recent disclosures about their 5nm process and I though it would be a good time to look at what we know about them and compare the two processes.

A lot of what has been announced about 5nm is in comparison to 7nm so we will first review 7nm.

7nm
Figure 1 compares Samsung’s 7LPP process to TSMC’s 7FF and 7FFP… Read More


SPIE Advanced Lithography Conference – Imec and Veeco on EUV

SPIE Advanced Lithography Conference – Imec and Veeco on EUV
by Scotten Jones on 04-19-2019 at 12:00 pm

At the SPIE Advanced Lithography Conference Imec presented several papers on EUV and Veeco presented about etching for EUV masks. I had the opportunity to see the presentations and speak with some of the authors. In this article I will summarize the key issues around EUV based on this research.

EUV is ramping up into high volume 7nm… Read More


SPIE Advanced Lithography Conference – ASML EUV Update

SPIE Advanced Lithography Conference – ASML EUV Update
by Scotten Jones on 03-23-2019 at 12:00 am

At the SPIE Advanced Lithography Conference ASML gave an update on both the current 0.33NA system and the 0.55 high-NA system development. I saw the presentations and got to sit down with Mike Lercel (Director of Strategic Marketing).… Read More


SPIE Advanced Lithography Conference 2019 Overall Impressions

SPIE Advanced Lithography Conference 2019 Overall Impressions
by Scotten Jones on 03-05-2019 at 6:00 am

Last week I attended the 2019 SPIE Advanced Lithography Conference. I gave two presentations, attended dozens of papers and conducted three interviews. I will be doing some detailed write ups particularly on EUV but I am waiting for the presentations from several of the papers. In the mean time I thought I would put some overall … Read More