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Yield, no topic is more important to the semiconductor ecosystem. After spending a significant part of my career on Design for Manufacturability (DFM) and Design for Yield (DFY), I’m seriously offended when semiconductor professionals make false and misleading statements that negatively affects the industry that … Read More
Humor can arise in surprising ways and yet still be disguised to many. As I was researching Qualcomm the other day, I came upon the transcript of their last quarterly earnings and I had to laugh. In the midst of last summer’s European crises, when the Club Med (Greece, Italy, Spain and Portugal) Sovereign Debt was trying to be rolled… Read More
It’s just a matter of time – perhaps just a few months – before the greatest mystery of the semiconductor industry is revealed and the peaceful co-existence of the Fab vs Fabless world is blown apart. An arms race was started by Intel to challenge TSMC and Samsung on who would control not only the high valued processor but soon… Read More
Some call it co-opetition (collaborative competition), some call it keeping your enemies close. Others call it for what it is, unfair competition and/or other types of legally actionable behavior. GlobalFoundries calls it“Fab Syncing”, which in reality will SINK their FABS!
“With this new collaboration, we are making one … Read More
During the weekend, I read two articles that highlighted Apple’s LCD supply chain build out and started to think of how this would look if Apple were to do the same on the x86 side of the ledger. The two articles, one related to Hitachi and Sony building a new 4” LCD for iphones and a more extensive one on Sharp building a new LCD for the iPAD3… Read More
3D-IC design has become a popular discussion topic in the past few years because of the integration benefits and potential cost savings, so I wanted to learn more about how the DRC and LVS flows were being adapted. My first stop was the Global Semiconductor Alliance web site where I found a presentation about how DRC and LVS flows were… Read More
Is it surprising to see that Synopsys has been selected Interface IP partner of the year by TSMC? Not really, as the company is the clear leader on this IP market segment (which includes USB, PCI Express, SATA, DDRn, HDMI, MIPI and others protocols like Ethernet, DisplayPort, Hyper Transport, Infiniband, Serial RapidIO…). But,… Read More
Ever since the TSMC OIP Forum where Dr. Shang-Yi Chiang openly asked customers, “When do you want 3D Transistors (FinFETS)?” I have heard quite a few debates on the topic inside the top fabless semiconductor companies. The bottom line, in my expert opinion, is that TSMC will add FinFETS to the N20 (20nm) process node in parallel with… Read More
Hello Daniel,
I am very interested on the articles on the PVT simulation, I have worked in that area in the past when I worked in process technology development and spice modeling and I also started a company called Device modeling technology (DMT) which built a Spice model library of discrete components, such as Bipolar/MOS /POWER… Read More
The TSMC OIP conference was Monday and Tuesday of last week. You have probably NOT read about it since it was invitation only and press was not invited. Slides were not made available (except for Mentor), no photos or video were allowed, it was a very private affair. Given that, I won’t be able to go into great detail but I will give you… Read More
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[_errors:protected] => Array
(
)
[_whenSaveable:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_whenSaveable:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)