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This comparison of smartphone processors from different companies and fab processes was originally going to be a post, but with the growing information content, I had to put it into an article. Here, due to information availability, Apple, Huawei, and Samsung Exynos processors will get the most coverage, but a few Qualcomm Snapdragon
Intel introduced the 8086 processor in 1978, leading to the x86 architecture in use today. I’m currently reverse-engineering the circuitry of the 8086 so I’ve been purchasing vintage 8086 chips off eBay. One chip I received is shown below. From the outside, it looks like a typical Intel 8086.
Summary
At the recent Intel Architecture Day 2020 symposium, a number of technology enhancements to the Intel 10nm process node were introduced. The cumulative effect of these enhancements would provide designs with a performance boost (at iso-power) approaching 20% – a significant intra-node enhancement, to be sure. The… Read More
I made it through the Virtual Intel Architecture Day last week and much to my surprise it was very well done. Virtual events have been hit and miss but this one was definitely a hit. Great content, approachable experts, a glitch-free experience. The mainstream media has been redundantly covering it so let me add my many years of experience,… Read More
Two bits of recent news has excited people in the semiconductor manufacturing space. First TSMC (bit.ly/384joVr) announced their intention to invest $12 B dollars in a Fab in Arizona. Then came the Corona-driven bipartisan proposed $23B federal government investment in semiconductor manufacturing (nyti.ms/2YZzFqnl). … Read More
Cyber security, economic growth, government leadership and industry support must be weighed
The debate
A healthy public debate is underway as to whether India should invest in semiconductor manufacturing. PVG Menon, former chair of the India Electronics and Semiconductor Association, supports the objective as part of a full… Read More
Last week, Intel announced its second-quarter financial results which easily beat the analysts’ consensus expectations by a handsome margin. Yet the stock price plummeted by over 16% right after the earnings call with management. Seven analysts downgraded the stock to a sell and the common theme on all the downgrades was that… Read More
I had the pleasure of spending time with Hiren Majmudar in preparation for the upcoming AI Accelerators webinar. As far as webinars go this will be one of the better ones we have done. Hiren has deep experience in both semiconductors and EDA during his lengthy career at Intel and now with a pure play foundry. He is intelligent, personable,… Read More
Thermo-compression bonding is used in heterogeneous 3D packaging technology – this attach method was applied to the assembly of large (12-stack and 16-stack) high bandwidth memory (HBM) die, with significant bandwidth and power improvements over traditional microbump attach.
The rapid growth of heterogeneous… Read More
Waving white surrender flag as TSMC dominates-
The quarter was a success but the patient is dying-
Packaging now critical as Moore progress stumbles-
Intel reported a great quarter but weak H2 guidance-
But 7NM slip and “fab lite” talk sends shockwaves-
Intel reported a great quarter beating numbers all around with… Read More
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