A recent announcement from Synopsys signals a meaningful escalation in the race to build next-generation AI hardware. The expanded collaboration between Synopsys and TSMC brings together silicon-proven IP, AI-driven design tools, and cutting-edge manufacturing processes in a tightly integrated effort to accelerate high-performance… Read More
Semiconductor Intellectual Property
Connecting the Dots: Why RISC-V System Design Is Entering a New Era
At the recent RISC-V Now event hosted by Andes, the discussion underscored the fact that RISC-V is no longer just about instruction set architecture advantages or customizable cores. The real focus has moved up the stack to system-level design. This is where connectivity, integration, and security define whether an innovation… Read More
Advanced Microelectronics Paving the Way for 6G with Alphacore
The world stands at the threshold of a new era in wireless communication as research communities, standards bodies, and technology companies begin shaping what will become sixth generation mobile networks. While fifth generation systems are still expanding across global markets, attention has already shifted toward defining… Read More
WAVE-N Specialized Video Processing NPU for Edge AI Systems
The rapid growth of AI applications in edge devices has created a strong demand for specialized hardware capable of performing high-performance neural network inference under strict power and latency constraints. Traditional CPUs and GPUs often struggle to meet the efficiency requirements of embedded and mobile systems.… Read More
Scalable Network-on-Chip Enables a Modular Chiplet Platform
The semiconductor industry is undergoing a profound transformation as system complexity, performance expectations, and time-to-market pressures continue to rise. Traditional monolithic system-on-chip (SoC) designs are increasingly giving way to modular, chiplet-based architectures that enable flexibility, scalability,… Read More
All in One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die
The rapid evolution of wireless audio has placed unprecedented demands on system integration, power efficiency, and performance. Against this backdrop, the webinar “All-in-One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die” offers a timely and technically rich exploration of how modern semiconductor design… Read More
Podcast EP343: How Ethernet is Enabling Advances in AI with Dr. Mohan Kalkunte
Daniel is joined by Dr. Mohan Kalkunte, Vice President of Architecture & Technology in the Core Switch Products group at Broadcom, where he leads architecture for Ethernet switching and NIC products across data center, enterprise, and service provider markets. With over 35 years of industry experience his previous stints… Read More
Transitioning Voltage Regulator Design From Unidirectional To Bidirectional
An interesting article by Nazzareno Rossetti, published in How2Power Today, explores the transition from designing traditional unidirectional voltage regulators to bidirectional converters essential for modern energy management systems (EMSs). These systems optimize energy flow and storage among electric vehicles,… Read More
Analog Bits Demos Real-Time On-Chip Power Sensing and Delivery on N2P at the TSMC 2026 Technology Symposium
Analog Bits has a way of stealing the show at every event they attend. The formula is actually quite straight-forward – come to the show with the most relevant, highest impact IP running on the most advanced process. The company will be applying this strategy again at the upcoming TSMC 2026 Technology Symposium with an array of real-time… Read More
Podcast EP342: The Evolution and Impact of Physical AI with Hezi Saar
Daniel is joined by Hezi Saar, Executive Director of Product Marketing at Synopsys, Hezi is responsible for the mobile, automotive, and consumer IP product lines. He brings more than 20 years of experience in the semiconductor and embedded systems industries.
Dan explores the growing field of physical AI with Hezi, who explains… Read More


TSMC CoWoS versus Intel EMIB Semiconductor Packaging