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Join our upcoming webinar on JESD204 and get insights into what we predict the upcoming JESD204D standard will contain, based on many years of experience working with JESD204.
Our expert speaker, Piotr Koziuk, has over a decade of experience with JESD204 standards and is a member of the JEDEC Standardization Committee. He will… Read More
In a recent marketing campaign, WhatsApp (and by extension, its parent company Meta) mocks the ubiquitous but unsecure messaging vehicle, SMS, saying anyone can read plain texts and mobile users should use some means of secure messaging. Apps like WhatsApp, Messenger, iMessage, and WeChat have each attracted over 1 billion … Read More
The Siemens Calibre group was very busy last week at SPIE. Calling Calibre industry leading really is an understatement. Calibre is one of the reasons Moore’s Law has continued to this day. This tool is legendary. You can get more information on the Calibre landing page including product information, resource guide, blogs
The talk of the table – or at least my end of the table – at the annual Cybersecurity Dinner – hosted by Copper Horse Ltd. – was the dismal state of IoT. Millions of devices are being connected – but no one is making money.
Of course that isn’t absolutely accurate. There are organizations that are able to make money in IoT,… Read More
The explosion in volume and consumption of data, fueled by industry trends in virtualization, networking, and computing among others, continues to push photonic solutions forward into leading positions. On Feb 2nd, I attended a panel by Ansys at DesignCon that brought together industry experts from Intel, GlobalFoundries,… Read More
The demand for efficient and scalable chip production has never been greater. The need to scale at volume and adapt to shorter innovation cycles makes machine learning and advanced data analytics essential components of semiconductor production.
Join us on Tuesday, March … Read More
The old adage: “If it ain’t broke, don’t fix it,” is as offensive to innovators as it is to grammarians. Just because something works well, doesn’t mean it cannot work better. As times change and technology advances, you either move forward or get left behind.
If you haven’t upgraded to the latest Ansys HFSS electromagnetic simulation… Read More
-Strength in trailing tools offsets weak memory resulting in flat
-Order book very volatile but backlog surprisingly still grew
-Trailing edge VS Leading edge = 50/50 – Foundry/logic over 2/3
-Not nearly as bad as Lam but not as good as ASML
Applied Materials… Read More
Intel and TSMC make up two of the three leading edge logic companies. At IEDM held in December 2022, Intel presented a paper on 2D Materials and TSMC presented 6 papers. Clearly 2D materials are of great interest at least to two of the three leading edge logic companies. Before diving into the papers, some background context is needed.… Read More
The first chiplets focused summit took place last month. So many accomplished speakers gave keynote talks on what direction should and would the Chiplets ecosystem evolution take. Corigine presented the keynote on what direction hardware emulation should and would evolve for speeding up chiplet- based designs. During a pre-conference… Read More
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