Advanced Packaging in the Chiplet Era semiwiki ads v2 800x100px (1)
WP_Term Object
(
    [term_id] => 157
    [name] => EDA
    [slug] => eda
    [term_group] => 0
    [term_taxonomy_id] => 157
    [taxonomy] => category
    [description] => Electronic Design Automation
    [parent] => 0
    [count] => 4541
    [filter] => raw
    [cat_ID] => 157
    [category_count] => 4541
    [category_description] => Electronic Design Automation
    [cat_name] => EDA
    [category_nicename] => eda
    [category_parent] => 0
    [is_post] => 
)

Mitigating the Effects of DFE Error Propagation on High-Speed SerDes Links

Mitigating the Effects of DFE Error Propagation on High-Speed SerDes Links
by Kalar Rajendiran on 04-18-2023 at 10:00 am

Pre and Post FEC BER as FEC Matrix size Reduces

As digital transmission speeds increase, designers use various techniques to improve the signal-to-noise ratio at the receiver output. One such technique is the Decision Feedback Equalizer (DFE) scheme, commonly used in high-speed Serializer-Deserializer (SerDes) circuits to mitigate the effects of channel noise and … Read More


AI Assists PCB Designers

AI Assists PCB Designers
by Daniel Payne on 04-17-2023 at 6:00 am

PCB steps min

Generative AI is all the rage with systems like ChatGPT, Google Bard and DALL-E being introduced with great fanfare in the past year. The EDA industry has also been keen to adopt the trends of using AI techniques to assist IC engineers across many disciplines. Saugat Sen, Product Marketing at Cadence did a video call with me to explain… Read More


Multi-Die Systems: The Biggest Disruption in Computing for Years

Multi-Die Systems: The Biggest Disruption in Computing for Years
by Daniel Nenni on 04-14-2023 at 6:00 am

SNUG Panel 1

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. The discussion was based on a report published by the MIT Technology Review Insights in cooperation with Synopsys. This is a very comprehensive report (12 pages) that is available online HERE.

Here is the prefaceRead More


Hardware Root of Trust for Automotive Safety

Hardware Root of Trust for Automotive Safety
by Daniel Payne on 04-13-2023 at 10:00 am

Rambus, RT 640,

Traveling by car is something that I take for granted and I just expect that my trips will be safe, yet our cars are increasingly using dozens of ECUs, SoCs and millions of lines of software code that combined together present a target for hackers or system failures. The Automotive Safety Integrity Levels (ASIL) are known by the letters:… Read More


Siemens EDA on Managing Verification Complexity

Siemens EDA on Managing Verification Complexity
by Bernard Murphy on 04-13-2023 at 6:00 am

2023 DVCon Harry Foster

Harry Foster is Chief Scientist in Verification at Siemens EDA and has held roles in the DAC Executive Committee over multiple years. He gave a lunchtime talk at DVCon on the verification complexity topic. He is an accomplished speaker and always has a lot of interesting data to share, especially his takeaways from the Wilson Research… Read More


Taking the Risk out of Developing Your Own RISC-V Processor with Fast, Architecture-Driven, PPA Optimization

Taking the Risk out of Developing Your Own RISC-V Processor with Fast, Architecture-Driven, PPA Optimization
by Daniel Nenni on 04-12-2023 at 10:00 am

Updated Speaker Slide

Are you developing or thinking about developing your own RISC-V processor? You’re not alone. The use of the RISC-V ISA to develop processors for SoCs is a growing trend. RISC-V offers a lot of flexibility with the ability to customize or create ISA and microarchitectural extensions to differentiate your design no matter your application… Read More


Optimizing Return on Investment (ROI) of Emulator Resources

Optimizing Return on Investment (ROI) of Emulator Resources
by Kalar Rajendiran on 04-12-2023 at 6:00 am

Verification Options SW vs HAV

Modern day chips are increasingly complex with stringent quality requirements, very demanding performance requirement and very low power consumption requirement. Verification of these chips is very time consuming and accounts for approximately 70% of the simulation workload on EDA server farms. As software-based simulators… Read More


WEBINAR: Design Cost Reduction – How to track and predict server resources for complex chip design project?

WEBINAR: Design Cost Reduction – How to track and predict server resources for complex chip design project?
by Daniel Nenni on 04-11-2023 at 6:00 am

picture innova

During the design of complex chips, cost reduction is becoming a real challenge for small, medium and large companies.  Resource management is a key to contain design cost.

The chip design market is expecting automated solutions to help in the resource prediction, planning and analysis. AI-based technologies are promising … Read More


Multiphysics Analysis from Chip to System

Multiphysics Analysis from Chip to System
by akanksha soni on 04-10-2023 at 10:00 am

Image 1 2

Multiphysics simulation is the process of computational methods to model and analyze a system to understand its response to different physical interactions like heat transfer, electromagnetic fields, and mechanical structures. Using this technique, designers can generate physics-based models and analyze the behavior… Read More


Feeding the Growing Hunger for Bandwidth with High-Speed Ethernet

Feeding the Growing Hunger for Bandwidth with High-Speed Ethernet
by Madhumita Sanyal on 04-10-2023 at 6:00 am

Picture2

The increasing demands for massive amounts of data are driving high-performance computing (HPC) to advance the pace in the High-speed Ethernet world. This in turn, is increasing the levels of complexity when designing networking SoCs like switches, retimers, and pluggable modules. This growth is accelerating the need for … Read More