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The 5G Rollout Safety Controversy

The 5G Rollout Safety Controversy
by Matt Commens on 01-21-2022 at 6:00 am

Plane Landing

There has been a lot of attention in the news recently about AT&T and Verizon rolling out their first implementations of sub-6GHz 5G radio access networks (RAN). Notably, the FAA and airline industries have voiced serious concerns about potential safety issues for aircraft autopilot and landing systems. As a result of these… Read More


Can you Simulate me now? Ansys and Keysight Prototype in 5G

Can you Simulate me now? Ansys and Keysight Prototype in 5G
by Shawn Carpenter on 01-10-2022 at 10:00 am

5G Signal propagation

Ansys and Keysight wanted to see if they could answer the question, If we put virtual cellphones in different locations in a city, can we predict what kind of 5G signal we’re going to get in those locations? To find out, they created and tested a detailed virtual model of a city, including a variety of 5G antennae, receivers, and transmitters… Read More


Cut Out the Cutouts

Cut Out the Cutouts
by Aaron Edwards on 12-23-2021 at 6:00 am

ANSYS HFSS 3D Layout 1

In 2014, many of the customers that my team and I supported in North America were still using HFSS 3D to model boards and packages. These customers were content with that interface, able to get their models setup quickly, and were okay with the solution times because when HFSS gave them an answer, they knew it was the right answer. I … Read More


Is Ansys Reviving the Collaborative Business Model in EDA?

Is Ansys Reviving the Collaborative Business Model in EDA?
by Daniel Nenni on 12-16-2021 at 10:00 am

Evolution of Multiphysics Complexity

The Electronic Design Automation (EDA) industry used to be a bustling bazaar of scrappy startups, along with medium sized companies that dominated a technology space, and big main-line vendors. The annual Design Automation Conference was noisy, hectic, and sprawled over multiple large convention halls. This diversity meant… Read More


A Practical Approach to Better Thermal Analysis for Chip and Package

A Practical Approach to Better Thermal Analysis for Chip and Package
by Daniel Nenni on 12-13-2021 at 6:00 am

ANSYS Thermal Chip Model

Thermal modeling has become a hot topic for designers of today’s high-speed circuits and complex packages. This has led to the adoption of better and more sophisticated thermal modeling tools and flows as exemplified in this presentation by Micron at the IDEAS Digital Forum. The presentation is titled “Thermal Aware Memory ControllerRead More


Ansys CEO Ajei Gopal’s Keynote on 3D-IC at Samsung SAFE Forum

Ansys CEO Ajei Gopal’s Keynote on 3D-IC at Samsung SAFE Forum
by Tom Simon on 12-09-2021 at 10:00 am

Ajei Gopal talks about 3D IC

System on chip (SoC) based design has long been recognized as a powerful method to offer product differentiation through higher performance and expanded functionality. Yet, it comes with a number of limitations, such as high cost of development.  Also, SoCs are monolithic, which can inhibit rapid adaptation in the face of changing… Read More


Ansys to Present Multiphysics Cloud Enablement with Microsoft Azure at DAC

Ansys to Present Multiphysics Cloud Enablement with Microsoft Azure at DAC
by Daniel Nenni on 12-01-2021 at 2:00 pm

Picture1 1

Ansys and Microsoft  collaborated extensively over the past year to optimize and test Ansys’ signoff multiphysics simulation tools on the Azure cloud. Microsoft has invited Ansys to present the joint results in Azure’s DAC booth theater in San Francisco this year.

Two presentations are planned: covering the enablement of AnsysRead More


Big Data Helps Boost PDN Sign Off Coverage

Big Data Helps Boost PDN Sign Off Coverage
by Tom Simon on 11-28-2021 at 8:00 am

PDN Sign Off

The nearly unavoidable truth about dynamic voltage drop (DVD) signoff for power distribution networks (PDN) is that the quality of results depends on the quality and quantity of the vectors used to activate the circuit switching. As SOCs grow larger and are implemented on smaller nodes, the challenges of sufficient coverage … Read More


Bonds, Wire-bonds: No Time to Mesh Mesh It All with Phi Plus

Bonds, Wire-bonds: No Time to Mesh Mesh It All with Phi Plus
by Matt Commens on 11-23-2021 at 10:00 am

Ansys Phi Plus

Automatic adaptive meshing in HFSS is a critical component of its advanced simulation process. Guided by Maxwell’s Equations, it efficiently refines the mesh to accurately capture both the geometric and electromagnetic detail of a design. The end result is a process that guarantees accurate and reliable simulation results… Read More


Optical I/O Solutions for Next-Generation Computing Systems

Optical I/O Solutions for Next-Generation Computing Systems
by Tom Simon on 10-28-2021 at 10:00 am

Multiphysics design

According to DARPA the fraction of total power consumed in semiconductors for I/O purposes as been growing rapidly and is creating an I/O power bottleneck. It has reached the point where it needs to be addressed with new technologies and approaches. Interestingly, while the energy density, as measured by pJ/bit for short reach… Read More