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John Lee: Market Trends, Raising the Bar on Signoff

John Lee: Market Trends, Raising the Bar on Signoff
by Bernard Murphy on 06-07-2018 at 7:00 am

I talked to John Lee (GM of the ANSYS Semiconductor BU) recently about his views on market trends and the ANSYS big-picture theme for DAC 2018. He set the stage by saying he really liked Wally’s view on trends (see my blog on Wally’s keynote at U2U). John said these confirm what he is seeing – a trend to specialization, some around… Read More


Webinar: Thermal and Reliability for ADAS and Autonomy

Webinar: Thermal and Reliability for ADAS and Autonomy
by Bernard Murphy on 05-15-2018 at 7:00 am

OK, so maybe the picture here is a little over the top, but thermal and reliability considerations in automotive in general and in ADAS and autonomy in particular, are no joke. Overheating, thermal-induced EM and warping at the board-level, in the package or interposers, are concerns in any environment but especially when you’re… Read More


Peering Over the Timing Edge

Peering Over the Timing Edge
by Bernard Murphy on 05-03-2018 at 7:00 am

I wrote recently about a yield problem which mobile vendors have been finding for devices built in advanced technologies. This was a performance issue (the devices worked fine at lower clock speeds), pointing to a discrepancy in some devices between predicted and observed timing. These were experienced design teams, using state… Read More


Stress and Aging

Stress and Aging
by Bernard Murphy on 04-05-2018 at 12:00 pm

These failings aren’t just a cross we humans bear; they’re also a concern for chips, particularly in electrical over-stress (EOS) and aging of the circuitry. Such concerns are not new, but they are taking on new urgency given the high reliability and long lifetime expectations we have for safety-critical components in cars and… Read More


A New Problem for High-Performance Mobile

A New Problem for High-Performance Mobile
by Bernard Murphy on 04-04-2018 at 7:00 am

About 6 months ago, ANSYS was approached by a couple of leading mobile platform vendors/suppliers with a challenging problem. These companies were hitting target 2.5GHz performance goals on their (N10 or N7) application processors, but getting about 10% lower yield than expected, which they attributed to performance failures.… Read More


EDA and Semiconductor — Is There Growth In The Ecosystem?

EDA and Semiconductor — Is There Growth In The Ecosystem?
by Alex Tan on 03-07-2018 at 12:00 pm


The semiconductor industry has gone through several major transitions driven by different dynamics such as shift in business models (fab-centric to fab-less), product segmentation (system design house, IP developers) and end market applications (PC to cloud; and recently, to both automotive and Internet of Things — IOT’s,Read More


Data Security – Why It Might Matter to Design and EDA

Data Security – Why It Might Matter to Design and EDA
by Alex Tan on 02-14-2018 at 12:00 pm


According to the Economist,
The world’s most valuable resource is no longer oil, but data”.
Is this the case?Data is the by-product ofmany aspects of recent technology dynamics and is becoming the currency of today’s digital economy. All categories in Gartner’s Top10 Strategic Technology Trends for 2018 (FigureRead More


Webinar: Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems

Webinar: Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems
by Bernard Murphy on 02-08-2018 at 7:00 am

In case you missed the TSMC event, ANSYS and TSMC are going to reprise a very important topic – signing-off reliability for ADAS and semi-autonomous /autonomous systems. This topic hasn’t had a lot of media attention amid the glamor and glitz of what might be possible in driverless cars. But it now seems like the cold light of real … Read More


Thermal Modeling for ADAS goes MultiPhysics

Thermal Modeling for ADAS goes MultiPhysics
by Bernard Murphy on 01-18-2018 at 7:00 am

In electronic system design, we have grown comfortable with the idea that different regimes of analysis, such as the chip, the package and the system, or electrical, thermal and stress are more or less independent – what starts in one regime stays in that regime, give or take some margin information passed onto other regimes. And… Read More


Creative Noise-Reduction in Automotive AMS

Creative Noise-Reduction in Automotive AMS
by Bernard Murphy on 12-12-2017 at 7:00 am

Automotive applications are one of the hottest domains today in semiconductor design. We’re bombarded daily with articles on new hybrids, electric cars, ADAS and autonomous cars, trucks and busses. All of these applications are certainly amazing, but the devices that make them work still have to deal with the same old challenges,… Read More