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Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors
latest reply by cheesehead onstarted by Daniel Nenni on -
SAMSUNG SAYS IT WILL BEAT TSMC’S 4NM PRODUCTION CAPACITY
latest reply by Mooredaddy onstarted by Daniel Nenni on -
ASML's secret sauce for semiconductor success amid challenges in the Angstrom Era
latest reply by BruceA onstarted by Daniel Nenni on -
Declining density scaling trend for TSMC nodes
latest reply by BruceA onstarted by Fred Chen on -
TSMC To Build Seven Factories In 2024, 3nm Capacity To Triple
latest reply by Daniel Nenni onstarted by Daniel Nenni on -
Top 5 semiconductor equipment sales increase in the first quarter with AI and China increasing in proportion
started by Daniel Nenni on -
Apple reportedly seeks to lock out its competitors from TSMC's 2nm process, by booking all of its manufacturing capacity
latest reply by hist78 onstarted by Daniel Nenni on -
The first Russian 350nm lithograph is being tested
latest reply by lilo777 onstarted by tonyget on -
The Technology Gap Between Leading Western and Chinese Semiconductor Foundries
latest reply by Fred Chen onstarted by Daniel Nenni on -
US moves to bar Huawei, other Chinese telecoms from certifying wireless equipment
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