Cadence Design Systems @ #54DAC!

Cadence Design Systems @ #54DAC!
by Daniel Nenni on 06-11-2017 at 8:00 am

This year Cadence Design Systems is showcasing system design enablement in their booth, capitalizing on the industry shift from naked chip design to system level chip design. Apple started it with making the chips inside the iProducts as part of the system and now other systems companies are looking to take more control over their… Read More


FD-SOI in Japan?

FD-SOI in Japan?
by Adele Hars on 05-27-2017 at 7:00 pm

If you want to get your finger on the Japan FD-SOI pulse, registration is still open for a free, two-day workshop in Tokyo this week organized by the SOI Consortium. This is the 3rd Annual SOI Tokyo Workshop, and there’s a really interesting line-up of speakers.

In case you’re wondering, Japan is doing FD-SOI. In fact… Read More


Webinar: Next Generation Design Data & Release Management

Webinar: Next Generation Design Data & Release Management
by Daniel Nenni on 05-12-2017 at 12:00 pm

Design Data Management (DDM) is a bit like insurance. It’s something every semiconductor company has to have, and as a result it’s probably something taken for granted. In order to make their products more useful, the DDM vendors have added more functionality to manage more of the lifecycle of design data.

Dassault’s Synchronicity… Read More


EDA CEO Outlook 2017

EDA CEO Outlook 2017
by Daniel Nenni on 04-28-2017 at 7:00 am

A long standing tradition has returned to EDA: The CEO Outlook sponsored by ESDA (formerly EDAC) which alone is worth the price of membership! Not only do you get a free meal, the event included quality networking time with the semiconductor elite. In the past, financial analysts moderated this event holding the CEO’s feet to the… Read More


A New Product for DRC and LVS that Lives in the Cloud

A New Product for DRC and LVS that Lives in the Cloud
by Daniel Payne on 04-17-2017 at 12:00 pm

Back in the day the Dracula tool from Cadence was king of the DRC and LVS world for physical IC verification, however more recently we’ve seen Calibre from Mentor Graphics as the leader in this realm. Cadence wanted to reclaim their earlier prominence in physical verification so they had to come out with something different… Read More


IP Vendors: Call for Contribution to the Design IP Report!

IP Vendors: Call for Contribution to the Design IP Report!
by Eric Esteve on 04-13-2017 at 12:00 pm

The EDA & IP industry enjoys high growth for the Design IP segment, but a detailed analysis tool is missing. IPnest will address this need in 2017, expecting the IP vendors’ contribution! If we consider the results posted last March by the ESD Alliance, the EDA (and IP) industry is doing extremely well, as the global revenue has… Read More


SPIE 2017 ASML and Cadence EUV impact on place and route

SPIE 2017 ASML and Cadence EUV impact on place and route
by Scotten Jones on 04-13-2017 at 7:00 am

As feature sizes have shrunk, the semiconductor industry has moved from simple, single-exposure lithography solutions to increasingly complex resolution-enhancement techniques and multi-patterning. Where the design on a mask once matched the image that would be produced on the wafer, today the mask and resulting image … Read More


PowerTree — a data repository and simulation platform for PCB power distribution networks

PowerTree — a data repository and simulation platform for PCB power distribution networks
by Tom Dillinger on 02-24-2017 at 12:00 pm

The difficulty of managing the power domains on a complex SoC led to the development of a power format file description, to serve as the repository for data needed for functional and electrical analysis (e.g., CPF, UPF). Yet, what about complex printed circuit boards? How can the power domain information be effectively represented… Read More


CEO Interview: Srinath Anantharaman of ClioSoft

CEO Interview: Srinath Anantharaman of ClioSoft
by Daniel Nenni on 02-20-2017 at 7:00 am

It will soon be 20 years since ClioSoft started its journey of selling design management software for the semiconductor industry. It was a slow start considering that designs were relatively small and only digital front-end designers had begun to realize the importance of version control and design management. With open source… Read More


Making Functional Simulation Faster with a Parallel Approach

Making Functional Simulation Faster with a Parallel Approach
by Daniel Payne on 02-14-2017 at 12:00 pm

I’ll never forgot working at Intel on a team designing a graphics chip when we wanted to simulate to ensure proper functionality before tapeout, however because of the long run times it was decided to make a compromise to speed things up by reducing the size of the display window to just 32×32 pixels. Well, when first silicon… Read More