Multi-die design is not a new concept. It has been around for a long time and has evolved from 2D level integration on to 2.5D and then to full 3D level implementations. Multiple driving forces have led to this progression. Whether the forces are driven by market needs, product needs, manufacturing technology availability or EDA… Read More
Siemens is excited to host this exclusive YouTube Premiere event. Discover the new features and enhancements in the forthcoming release of Simcenter 3D, the most comprehensive and fully integrated CAE solution.
Learn how Simcenter 3D can accurately model the complexity of your products, make your simulation processes faster,
LIVE WEBINAR | 22 JULY 2021 10:00 AM EDT
In this webinar, Siemens and Virtualware present advances in sharing and visualizing 3D models using the JT file format.
Driven by new ways of working, companies are making the most of 3D visualization and collaboration software deployed on desktop, cloud, and mobile devices in the office,
If you are doing high speed-design, don’t miss this half-day online forum hosted by SI Journal and featuring industry leaders, such as Google and Microsoft. The event will cover key design topics on high speed-system designs with a keynote “Interconnect Modeling and its Importance to HSSD Simulation” by Eric Bogatin, … Read More
For all the time we spend thinking and talking about silicon design, it’s easy to forget just how important package design is. Semiconductor packages have evolved over the years from very basic containers for ICs into very specialized and highly engineered elements of finished electronic systems. They play an important role … Read More
