High-Speed Digital 3D EM Forum

If you are doing high speed-design, don’t miss this half-day online forum hosted by SI Journal and featuring industry leaders, such as Google and Microsoft. The event will cover key design topics on high speed-system designs with a keynote “Interconnect Modeling and its Importance to HSSD Simulation” by Eric Bogatin, Professor at ECEE Univ of Colorado, Boulder, Technical Editor for SI Journal, and Teledyne LeCroy Fellow.

The featured presentations are:

• Keynote: Interconnect Modeling and its Importance to HSSD Simulation
• Google: Folding and Simulating a Rigid-Flex PCB: It is Easier than You Might Think
• Microsoft: Signal Integrity and Power Integrity Optimization Work Flow for Display Sub-System in Mixed-Reality Products Using 3D EM Simulation
• Cadence: 3D FEM Solver Scalability: Ready to Go Big?

Date: Wednesday, May 26, 2021

Time: 1:00-5:00pm EDT