Flash Memory Summit Conference

Flash Memory Summit Conference
by Admin on 08-02-2022 at 12:00 am

Why Attend Flash Memory Summit?

FMS is the best networking opportunity in the storage industry!

The 2022 conference is expanding beyond flash memory to address all forms of high performance memory. Summit organizers welcome your submissions on a range of memory technologies including NAND Flash, DRAM, MRAM, ReRAM, and DNA storage.… Read More


Cadence TECHTALK: Fast and Easy Rigid and Rigid Board Analysis with the Clarity 3D Solver

Cadence TECHTALK: Fast and Easy Rigid and Rigid Board Analysis with the Clarity 3D Solver
by Admin on 05-31-2022 at 12:00 am

Meeting date: May 31, 2022

Meeting time: 14:00 – 15:00 (Beijing time)

Rigid-flex PCBs are used in many modern electronic devices (such as mobile phones, laptops, and wearables, etc.) due to their form factor, light weight, and cost-effectiveness. Due to the complexity of 3D designs, electromagnetic (EM) analysis of

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Combining system simulation and 3D CFD for haemodynamic modeling

Combining system simulation and 3D CFD for haemodynamic modeling
by Admin on 04-27-2022 at 12:00 am

Since the advent of computational fluid dynamics (CFD) in the biomedical sector, there has been a progressive trend towards the use of in-silico methods for surgical planning and evaluation. Establishing a credible model for CFD haemodynamic studies necessitates adhering to best practices. Additionally, a repeatable methodology… Read More


Upcoming Webinar: 3DIC Design from Concept to Silicon

Upcoming Webinar: 3DIC Design from Concept to Silicon
by Kalar Rajendiran on 01-26-2022 at 10:00 am

Lessons from Existing Multi Die Solutions

Multi-die design is not a new concept. It has been around for a long time and has evolved from 2D level integration on to 2.5D and then to full 3D level implementations. Multiple driving forces have led to this progression.  Whether the forces are driven by market needs, product needs, manufacturing technology availability or EDA… Read More


What’s new in Simcenter 3D 2022.1?

What’s new in Simcenter 3D 2022.1?
by Admin on 01-11-2022 at 12:00 am

Siemens is excited to host this exclusive YouTube Premiere event. Discover the new features and enhancements in the forthcoming release of Simcenter 3D, the most comprehensive and fully integrated CAE solution.

Learn how Simcenter 3D can accurately model the complexity of your products, make your simulation processes faster,

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3D visualization and collaboration: The JT advantage

3D visualization and collaboration: The JT advantage
by Admin on 07-22-2021 at 12:00 am

LIVE WEBINAR | 22 JULY 2021 10:00 AM EDT

In this webinar, Siemens and Virtualware present advances in sharing and visualizing 3D models using the JT file format.

Driven by new ways of working, companies are making the most of 3D visualization and collaboration software deployed on desktop, cloud, and mobile devices in the office,

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Optimizing High Performance Packages calls for Multidisciplinary 3D Modeling

Optimizing High Performance Packages calls for Multidisciplinary 3D Modeling
by Tom Simon on 10-16-2019 at 10:00 am

For all the time we spend thinking and talking about silicon design, it’s easy to forget just how important package design is. Semiconductor packages have evolved over the years from very basic containers for ICs into very specialized and highly engineered elements of finished electronic systems. They play an important role … Read More