Antenna/RF design problems often involve the optimization of many variables, requiring numerous evaluations (EM simulations) using traditional optimization methods. Design engineers need an intelligent, accurate, and easy-to-use simulation platform and analysis solution that reduces repetitive design cycles while… Read More
The GSA European Executive Forum is our flagship event in Europe which, over two days, always attracts the very top speakers and attendees: 300 senior decision makers, the majority VP and C-level profiles.
Over the past 20 years, it has become the reference executive event for the semiconductor industry in the EMEA region.
This… Read More
For a long time, package engineering was part of the cleanup crew for chip design. The glory was all around the design of advance monolithic chips on the latest technology node. Once the design was done, the package/test team would take the design over the finish line, adding the required I/O specs, lead frame, load board and test … Read More
Join us to discover how RFPro offers accurate modeling of electromagnetic (EM) effects and streamlines simulation setup. Gain insights into easily analyzing multi-technology modules and efficiently identifying and resolving design issues using RFPro’s 3D EM-circuit co-simulation, all without the need to modify… Read More
Join us for this webinar on RF GaN amplifier design using electromagnetic/thermal 3D solvers. We will discuss the step-by-step process of building a GaN amplifier, beginning with the transistor model in the circuit simulator. The webinar will outline the steps required to convert this to a physical layout for electromagnetic… Read More
SMARTER SYSTEMS THROUGH HETEROGENEOUS INTEGRATION
Thank you to all the participants who took part in the 3D & Systems Summit 2023. Save the date for the 2024 event, which will take place on June 12-14 in Dresden, Germany. Please review the 2023 event agenda below. The 2024 information will be available at a later stage.
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Description
Join industry experts from aerospace, government, and defense as they discuss the complexities of 3D Heterogeneous Integration (3DHI), highlighting some of the technological, manufacturing, and economic complexities as well as security, reliability, and safety challenges. The panelists will also share … Read More
Intel recently issued a press announcement that has significant implications for the future of semiconductors. The release announces Intel’s new glass substrate technology. The headline states: Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules… Read More
Join us at ATC Romania 2023
The 2023 edition of ATC Romania returns to discuss the latest trends, technologies, and innovations powered by the convergence of computational science and artificial intelligence (AI). Hear Altair experts and customers speak about how to address today’s product development challenges, accelerate
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Live Webinar | September 13th, 2023, 10 – 11 AM (EDT)/ 16:00 – 17:00 (CET)
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