proteanTecs Technology Helps GUC Characterize Its GLink™ High-Speed Interface

proteanTecs Technology Helps GUC Characterize Its GLink™ High-Speed Interface
by Kalar Rajendiran on 11-15-2022 at 6:00 am

proteanTecs D2D Monitoring Hardware Block Diagram

An earlier post on SemiWiki discussed how deep data analytics helps accelerate SoC product development. The post presented insights into proteanTecs’ technology and quantified the benefits that can be derived by leveraging the software platform for SoC product development. You can review that earlier blog here. The power … Read More


Webinar: The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

Webinar: The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
by Admin on 11-07-2022 at 3:10 pm

November 16, 2022 | 9:00 AM PT | 12:00 PM ET | 6:00 PM CET
(A recording will be sent after the live event to all registrants)

The era of chiplets and heterogeneous integration is here. High-end performance packaging will be a $7.87 billion market by 2027, with a 19% CAGR.1

As the semiconductor industry adopts chiplets and heterogeneous… Read More


Webinar: Battery Cooling Simulations – Obtaining 3D Results & Thermal Cell Properties Efficiently

Webinar: Battery Cooling Simulations – Obtaining 3D Results & Thermal Cell Properties Efficiently
by Admin on 10-10-2022 at 2:52 pm

The Future of Electrification

Free Webinar Series

The global demand for energy continues to increase and the diversity of sources is growing. Through the Altair Partner Alliance (APA), we are helping customers explore sustainable generation, achieve efficient distribution, maintain reliable power grids, and transform

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Flash Memory Summit Conference

Flash Memory Summit Conference
by Admin on 05-26-2022 at 4:26 pm

Why Attend Flash Memory Summit?

FMS is the best networking opportunity in the storage industry!

The 2022 conference is expanding beyond flash memory to address all forms of high performance memory. Summit organizers welcome your submissions on a range of memory technologies including NAND Flash, DRAM, MRAM, ReRAM, and DNA storage.… Read More


Cadence TECHTALK: Fast and Easy Rigid and Rigid Board Analysis with the Clarity 3D Solver

Cadence TECHTALK: Fast and Easy Rigid and Rigid Board Analysis with the Clarity 3D Solver
by Admin on 05-20-2022 at 1:44 pm

Meeting date: May 31, 2022

Meeting time: 14:00 – 15:00 (Beijing time)

Rigid-flex PCBs are used in many modern electronic devices (such as mobile phones, laptops, and wearables, etc.) due to their form factor, light weight, and cost-effectiveness. Due to the complexity of 3D designs, electromagnetic (EM) analysis of

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Combining system simulation and 3D CFD for haemodynamic modeling

Combining system simulation and 3D CFD for haemodynamic modeling
by Admin on 04-19-2022 at 2:29 pm

Since the advent of computational fluid dynamics (CFD) in the biomedical sector, there has been a progressive trend towards the use of in-silico methods for surgical planning and evaluation. Establishing a credible model for CFD haemodynamic studies necessitates adhering to best practices. Additionally, a repeatable methodology… Read More


Upcoming Webinar: 3DIC Design from Concept to Silicon

Upcoming Webinar: 3DIC Design from Concept to Silicon
by Kalar Rajendiran on 01-26-2022 at 10:00 am

Lessons from Existing Multi Die Solutions

Multi-die design is not a new concept. It has been around for a long time and has evolved from 2D level integration on to 2.5D and then to full 3D level implementations. Multiple driving forces have led to this progression.  Whether the forces are driven by market needs, product needs, manufacturing technology availability or EDA… Read More


What’s new in Simcenter 3D 2022.1?

What’s new in Simcenter 3D 2022.1?
by Admin on 12-09-2021 at 2:56 pm

Siemens is excited to host this exclusive YouTube Premiere event. Discover the new features and enhancements in the forthcoming release of Simcenter 3D, the most comprehensive and fully integrated CAE solution.

Learn how Simcenter 3D can accurately model the complexity of your products, make your simulation processes faster,

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3D visualization and collaboration: The JT advantage

3D visualization and collaboration: The JT advantage
by Admin on 07-03-2021 at 4:18 pm

LIVE WEBINAR | 22 JULY 2021 10:00 AM EDT

In this webinar, Siemens and Virtualware present advances in sharing and visualizing 3D models using the JT file format.

Driven by new ways of working, companies are making the most of 3D visualization and collaboration software deployed on desktop, cloud, and mobile devices in the office,

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