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Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and AnalysisIn a major announcement at the 2025 Design…Read More
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Before going to Munich to attend to CDN-Live, I took a look at the agenda to figure out which presentations to attend, and I must say it was not so easy to choose: CDN Live agendais dense, with multiple tracks running in parallel (Custom Design, Digital Implementations, Design IP, Functional Verifications and Verification IP, PCB… Read More
Perhaps the most pertinent comment raised by an analyst at Intel’s Investor Forum last week came from Dan Hutcheson of VLSI Research to Brian Krzanich, the COO and head of global manufacturing and supply chain. He said: “I think you sold yourself short on Trigate, the benefit of fully depleted vs. planar and the impact on leakage.”… Read More
Yesterday’s SEMICO IP Ecosystem Conference was well worth the time. Everybody was there: ARM, Synopsys, Cadence, Mentor Graphics, GlobalFoundries, TSMC, MIPS, Tensilica, AMD, Atrenta, Sonics, and Tabula, everybody except Intel of course. What do Intel and I have in common? We don’t play well with others…
First up was… Read More
Talk about an unusual position. Intel finds themselves very much currently outside when it comes to mobile SoCs for phones and tablets. After several attempts at soul-searching and a true understanding of the term “low-power” (not meaning 3W, but instead < 1W), they finally have a part – in the form of “Medfield”, aka the Atom… Read More
Anybody working in the wireless handset segment probably knows that CEVA is the provider of DSP IP cores, and if you are simply a wireless handset user, you should know that the baseband digital signal processing is the function allowing your phone to process the RF (analog) signal coming from the outside world. If you have been involved… Read More
CPAK sounds like something politicians create to collect money, but in fact it is a Carbon Performance Analysis Kit. It consists of models, reference platform, initialization software (for bare metal CPAKs) or OS binary (for Linux and Android based CPAKs). They are (or will soon be) available for ARM Cortex A9, ARM Cortex A15 and… Read More
This just in from Tech Trader Daily, quoting Piper Jaffraychip analyst Gus Richard:
The whole issue for Qualcomm, based on Richard’s conversations with industry types, is that the company has started making its “MSM8960″ chip with Taiwan Semiconductor Manufacturing (TSM) only two to three quarters after TSM introduced… Read More
The Linley Group, whose conference on mobile I recently attended, has some interesting data about the processor core market. Firstly, the numbers are big: CPU cores shipped in over 10 billion chips last year which is up 25% on last. ARM has a share of 78% of that entire market. The big surprise to me was the #2 was not MIPS but Synopsys… Read More
Yesterday I met with Michael Buehler-Garcia, Director of Marketing at Mentor Graphics for Calibre in Wilsonville, Oregon to get an update on what’s coming up at DAC, the premier conference and trade show for our industry.
What’s new at Cadence? Quite a bit actually. I have always been a Cadence fan, I mean really, they gave birth to modern EDA. Unfortunately, Cadence really lost me during the Avant! legal action, the Mike Fister years, and EDA360. Recently, however, Cadence has made some big changes that will definitely get them back on my good side.… Read More
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Facing the Quantum Nature of EUV Lithography