TSMC Advanced Packaging Overcomes the Complexities of Multi-Die DesignThe TSMC Technology Symposium provides a worldwide stage…Read More
Accelerate SoC Design: Addressing Modern Prototyping Challenges with S2C's Comprehensive Solutions (II)In the fast-paced world of Electronic Design Automation…Read More
CEO Interview: Dieter Therssen of SigasiDieter Therssen obtained his master's degree in Electronics…Read More
3DIC Verification Methodologies for Advanced Semiconductor ICsAt the recent User2user conference, Amit Kumar, Principal…Read More
Electro-static discharge (ESD) has been a problem since the beginning of IC production. Chips function on power supplies of up to a few volts (depending on the era) whereas ESD voltages are measured in the thousands of volts. When you reach out for your car door handle and a spark jumps across, that is ESD. If you were touching a chip… Read More
A High-Definition Multimedia Interface (HDMI) IP core was being implemented in an advanced process technology. This fairly large and complex analog mixed-signal (AMS) IP comprising over 130K devices was close to being finalized and shipped to the customer. But many design rules at the foundry were unexpectedly changed from… Read More
Reading the title you guessed it right, Mentor Graphics has three new board members today from the slate offered by billionaire activist Carl Icahn:
The traditional way for analyzing the effectiveness of testing in the software world and in the RTL world is code coverage. Make sure that every line of code is executed. This is a pretty crude measure since even 100% code coverage doesn’t mean that all the condition has really been tested but it is certainly necessary–after… Read More
If you just casually peruse most marketing presentations by EDA companies, you’d come to the conclusion most SoCs are designed from scratch, wrestlilng the monster to the ground with bare hands. But the reality is that most SoCs consist of perhaps 90% IP blocks (many of them memories). That still leaves the remaining 10% … Read More
Hard to believe a year has gone by since the big announcement of the Cadence Blueprint toBattle ‘Profitability Gap’; Counters Semiconductor Industry’s Greatest Threat! Having spent more time on it that I should have, here is my opinion on EDA360 on its first anniversary.
Richard Georing did a very nice anniversary piece “Ten Key… Read More
The problem:To move dual-port SRAM library and macros from a 40nm process to a 28nm process. In addition to all the changes between two different foundry processes, the 28nm rules are disruptive and incompatible with the previous rules. The memory corecells (foundry-specific) would also need to be completely replaced.
Current… Read More
Intel had a big press event yesterday at which they announced details of their 22nm process. In a change from their current processes, it goes with a vertical gate. In fact 3 gates which gives them much better control of leakage through transistors that are switched off, along with more transmission through the on transistors. They… Read More
As the complexity of the chip-package-system (CPS) interactions has increased, the tradeoffs in doing a power and noise analysis has had to gradually increase. As is so often the case in semiconductor designs, issues first arise as second-order effects that can largely be ignored but each process node makes the problem worse … Read More
DAC is less than a month away, June 6-8th for the tradeshow, longer depending on what other events you might also be attending. Apache is in booth 2448 (marked in red on the DAC floorplan map.
Many of the presentations at the Apache booth will be customers (such as ARM, Xilinx, ST Ericsson, GlobalFoundries and TSMC) discussing various… Read More
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TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design