Increasingly, SoC designs consist of assembling blocks of pre-designed IP. One special case is the derivative design where not just the IP blocks get re-used but a lot of the assembly itself. For example, in the design below some blocks are added, some blocks are updated, some hierarchy is changed. But the bulk of the design remains… Read More
Rethinking Formal Verification in the AI EraBy Kanav Arora, ML Researcher at ChipAgents Most…Read More
CEO Interview with Ann Wu and Akash Levy of SilimateAnn Wu is Co-founder & CEO of Silimate.…Read More
From Process Learning to Production Control: Characterization for the Era of Heterogeneous SystemsEvery generation of semiconductor innovation has relied on…Read More
Five Myths about the Current Memory BoomThe current semiconductor memory boom is mainly an…Read More
How Fast Can a Performance Model Actually Be Built?By Thang Tran, CEO of Simplex Micro and…Read MoreIncreasing Automotive Semiconductor Test Quality
The growing amount of electronics within today’s automobiles is driving very high quality and reliability requirements to a widening range of semiconductor devices. At the same time, traditional fault models are becoming less effective at achieving desired silicon quality levels. Improvements in test solutions are needed… Read More
Formality Ultra, Streamline Your ECOs
One of the most challenging stages in an SoC design is achieving timing closure. Actually design closure is perhaps a better term since everything needs to come together such as clock tree, power nets, power budget and so on. Changes made to the design are known as ECOs (which stands for engineering change orders, a term that comes… Read More
Taiwan Semiconductor Tries To Pull A FinFAST One!
This completely misleading title is from a Seeking Alpha (SA) article, a stock investment version of the National Enquirer. As I mentioned inA Call to ARMs, fame and fortune seeking SA Authors make a penny per click so sensationalism sells. The article is not worth your time so I will save you the click and skip to the misguided conclusion:… Read More
Should You Buy All Aspects of Your IP From a Single Supplier?
Interface IP typically consists of multiple layers, most importantly a PHY (level 1) analog (or mixed signal) block that handles the interface to the outside world and a number of levels of digital controllers. The interfaces between all these levels, especially between the PHY and the controller, is often defined by the interface… Read More
Swap and Play Extended To Chip Fabric and Memory Controllers
Virtual platforms enable software development to take place on a model of an electronic system. What everyone would like is models that are fast and accurate but that is simply not possible. Fast models are fast because they don’t model everything at the signal level. And accurate models get to be accurate by handling a lot of detail… Read More
Eldo and Pyxis from Mentor, DAC Update
Last Monday at DAC I met with Linda Fosler, Marketing Director at Mentor Graphics to get an update on what’s new with Eldo(Circuit simulator) and Pyxis (custom IC layout and schematic).
Linda Fosler, Mentor Graphics… Read More
Calibre Update at DAC
Mentor Graphics throws a very nice dinner party at DAC each year for journalists, bloggers and top customers, so this year I spoke with Michael Buehler-Garcia about what’s new with Calibre.
Michael Buehler-Garcia, Mentor Graphics
… Read More
Tela Innovations, DAC Update
Lawsuits in EDA are common, and Tela Innovationsfiled a huge complaint back in February with the U.S. International Trade Commission (USITC) against HTC Corporation; HTC America, Inc.; LG Electronics, Inc.; LG Electronics U.S.A., Inc.; LG Electronics MobileComm U.S.A., Inc.; Motorola Mobility LLC; Nokia Corporation; Nokia,… Read More
GPU-Based SPICE Simulator for Library Characterization
Jeff Tuanis the CEO and President of an EDA startup called G-Analog, founded in May 2012. His background includes working at: Cadence, Epic, Synopsys, Nassda, Chartered Semi and GLOBALFOUNDRIES. Jason Lu is the R&D manager. We met at DAC last week to talk about his company’s new product called Gchar for IC library characterization… Read More


ASML High-NA EUV is Not Ready for High-Volume Production