CEO Interview with Vamshi Kothur, of Tuple TechnologiesIt was my pleasure to meet with Vamshi…Read More
Webinar – Power is the New Performance: Scaling Power & Performance for Next Generation SoCsWhat if you could reduce power and extend…Read More
Reachability in Analog and AMS. Innovation in VerificationCan a combination of learning-based surrogate models plus…Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural PivotIn 2003, legendary computer architect Michael J. Flynn…Read More
On Wednesday at DAC I met with Bob Slee, distributor and Michael Siu, AE for MunEDA to get an update on what’s new. MunEDA has EDA software for:
Fergus Slorach, CTO and Founder of Methodics met with me at DAC on Wednesday afternoon to provide an update on software configuration management for hardware designers.… Read More
Sunday Night – you have to network at the EDAC kick-off party.… Read More
Paul Estrada, COO of Berkeley DA met with me on the final day of DAC to provide an update. BDA coined the phrase Analog FastSPICE and have continued to dominate that market segment in the world of SPICE circuit simulators.… Read More
Ed wrote recently about Microsoft going thermonuclear. I think that they already did. Ed wrote about Microsoft’s tablet announcement. The second announcement is a sort of follow up to my blog on what will happen to Nokia.
Two big announcements, the first one is that Microsoft is going to produce its own tablet computers (MiPads … Read More
I met with Jay Madiraju of Mentor Graphics on Wednesday at DAC to get an update on their AMS simulation products. We worked together at Mentor back when Mach TA was being developed as a Fast SPICE circuit simulator.… Read More
Rajiv Bhateja, Dhrumil Gandhi and Neal Carney met with me at DAC on Wednesday to give an update on what’s new in 2012 for Tela Innovations, a provider of lithography optimized IP and tools. This team has a rich history in EDA and IP from companies like: ARM, Artisan, Mentor Graphics and Silicon Compilers.… Read More
At the TSMC Theater Apache (don’t forget, now a subsidary of Ansys) talked about Emerging Challenges for Power, Signal and Reliability Verification on 3D-IC and Silicon Interposer Designs. The more I see about the costs and challenges of 20/22nm and below, the more I think that these 3D and 2.5D approaches are going to be … Read More
Most of what you see at DAC is canned PowerPoint presentations, however on Tuesday afternoon I spotted a company called Oski Technology that was doing something almost unheard of – they had an engineer debugging a digital design from Nvidia using formal tools live. I later found out the engineer found 4 bugs in just three days… Read More
Dr. Raul Camposano, CEO of Nimbic talked with me on Wednesday at DAC to provide an update on what’s new with their electromagnetic simulation tools.… Read More
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Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot