I will see you at the Substrate Vision Summit in Santa ClaraWIth packaging being one of the top sources…Read More
The Immensity of Software Development and the Challenges of Debugging Series (Part 4 of 4)The Impact of AI on Software and Hardware…Read More
Alchip is Paving the Way to Future 3D Design InnovationAt the recent TSMC OIP Ecosystem Forum in…Read More
Part I is here.
In the panel session at EDPS on 3D IC a number of major issues got highlighted (highlit?).
The first is the problem of known-good-die (KDG) which is what killed off the promising multi-chip-module approach, perhaps the earliest type of interposer. The KDG problem is that with a single die in a package it doesn’t… Read More
Wally Rhines’ keynote at U2U, the Mentor users’ group meeting, was about Mentor’s strategy of focusing on what other people don’t do. This is partially a defensive approach, since Mentor has never had the financial firepower to have the luxury of focusing all their development on sustaining their products and then make … Read More
The press release about ONFI 3.0 support was launched by Cadence at the beginning of this year. It was a good illustration of Denali, then Cadence, long term commitment to Nand Flash Controller IP support. The ONFI 3 specification simplifies the design of high-performance computing platforms, such as solid state drives and enterprise… Read More
Recently I was researching the keynote speeches of isQED (International Society for Quality Electronic Design) Symposium 2012 and saw the very first, great presentation, “Taming the Challenges in Advanced Node Design” by Tom Beckley, Sr. VP at Cadence. I know Tom very well as I have worked with him and I admire his knowledge, authority… Read More
The second day (more like a half-day) of EDPS was devoted to 3D ICs. There was a lot of information, too much to summarize in a few hundred words. The keynote was by Riko Radojcic of Qualcomm, who has been a sort of one-man-band attempting to drive the EDA and manufacturing industries towards 3D. Of course it helps if you don’t … Read More
If I say “graphics chip”, most techies will say NVIDIA or AMD. But in the new post-PC world , neither of these players holds the key to the future. One that does is a little company making 43 cents on every latest version iPad and iPhone. Another is designing their own approach. Should you care what graphics is in your phone?… Read More
This morning I attended a webinar about MEMS and IC co-design from a company called SoftMEMS along with Tanner EDA. I learned that you can co-design MEMS and IC either in a bottom-up or top-down methodology, and that this particular flow has import/export options to fit in with your mechanical simulation tools (Ansys, Comsol, Open… Read More
Oasys announced that it closed its series B funding round with investments from Intel Capital and Xilinx. The fact that any EDA company has closed a funding round is newsworthy these days; companies running out of cash and closing the doors seems to be a more common story.
Oasys has been relatively quiet, which some people have taken… Read More
As a blogger I write weekly about the EDA industry and certainly our industry enables products like Smart Phones and Tablets to even exist, however if we really believed in these mobile devices then what should our web sites look like on a mobile device?
It’s a simple question, yet I first must define mobile-friendly before… Read More
Mike Hutton of Altera spends most of his time thinking about a couple of process generations out. So a lot of what he worries about is not so much the fine-grained architecture of what they put on silicon, but rather how the user is going to get their system implemented. 2014 is predicted to be the year in which over half of all FPGAs will… Read More
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More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay