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Studies have shown that nearly 20% of the verification cycle is spent on assertion generation, debugging, and methodology integration. This work remains largely manual today or is delegated to general-purpose LLMs that can produce incorrect assertions more than 30% of the time. Avestra attacks this problem with agentic AI … Read More
The semiconductor industry is entering a period in which manufacturing leadership will depend not simply on producing more data, but on turning that data into timely, trustworthy decisions. PDF Solutions CONNECT 2026 is designed around this challenge. Taking place October 15–16 at the Westin St. Francis in San Francisco, the… Read More
We all know timing closure is one of the most challenging processes in chip design. Extracting actionable insight from massive timing reports, tracing violations back to RTL, and selecting the right fix across complex PPA tradeoffs all require deep expertise. And every change can trigger hours or days of tool runs and cross-team… Read More
OpenAI’s Jalapeño is a custom accelerator designed specifically for AI inference, particularly the low-latency, multi-chip workloads behind interactive and agentic systems. Its central idea is that useful performance cannot be reduced to peak floating-point operations or memory bandwidth. What matters is how quickly … Read More
On the last day of #DAC2026 I stopped by the Keysight booth to chat with Nilesh Kamdar, GM of EDA Business to get an update. He has spent 27 years in the industry, and this made 25 DAC trips for him. For Keysight the application areas of focus are serving designers of high frequency and high-speed digital, RF, and mm/uwave designs. An … Read More
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Source: Jonathon Evans and Polychronis Xekalakis, “NVIDIA Vera CPU,” Hot Chips 2026. Performance figures are NVIDIA claims, and several results were based on preproduction or unofficial testing.
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Intel Foundry and ASML say high-numerical-aperture extreme-ultraviolet lithography has crossed an important boundary: it is no longer only a development tool, but a production technology. At the SPIE Photomask Technology and Extreme Ultraviolet Lithography conference, the companies reported that Intel has processed … Read More
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Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung Foundry