More Headwinds - CHIPS Act Chop? - Chip Equip Re-Shore? Orders Canceled & Fab Delay- CHIPS Act more likely to be maimed…Read More
Next Generation of Systems Design at SiemensElectronic systems design is filled with a wide…Read More
Samtec Paves the Way to Scalable Architectures at the AI Hardware & Edge AI SummitAI is exploding everywhere. We’ve all seen the…Read More
Tier1 Eye on Expanding Role in Automotive AIThe unsettled realities of modern automotive markets (BEV/HEV,…Read More
Dan is joined by Rob Knoth, Solutions Architect in the Strategy and New Ventures group at Cadence. He is a technologist focusing on corporate strategy and the interfaces between domain specific solutions. A key area of expertise is the digital implementation of safety critical and high reliability systems. He has extensive experience… Read More
Sandeep Kumar is the Chief Executive of LTSCT (L&T Semiconductor Technologies Ltd). A seasoned technology executive with over 35 years of experience, Kumar has a proven track record in building and scaling technology businesses globally.
As a pioneer in the Indian semiconductor industry, he has co-founded multiple technology… Read More
WSTS reported third-quarter 2024 semiconductor market growth of $166 billion, up 10.7 percent from second-quarter 2024. 3Q 2024 growth was the highest quarter-to-quarter growth since 11.6% in 3Q 2016, eight years ago. 3Q 2024 growth versus a year ago was 23.2%, the highest year-to-year growth since 28.3% in 4Q 2021.
Nvidia remained… Read More
An animated panel discussion Design Automation Conference in June offered up a view of the state of RISC-V and open-source functional verification and a wealth of good material for a three-part blog post series.
Parts One and Two covered a range of topics from microcontroller versus more general-purpose processor versus running… Read More
Next generation semiconductor design puts new stress on traditionally low-key parts of the design process. One example is packaging, which used to be the clean-up spot at the end of the design. Thanks to chiplet-based design, package engineers are now rock stars. Analog design is another one of those disciplines.
Not long ago,… Read More
WIth packaging being one of the top sources of traffic on SemiWiki, I am expecting a big crowd at this event. A semiconductor substrate is a foundational material used in the fabrication of semiconductor devices. Substrates are a critical part of the manufacturing process and directly affect the performance, reliability, and… Read More
When the potential for AI at the edge first fired our imagination, semiconductor designers recognized that performance (and low power) required an accelerator and many decided to build their own. Requirements weren’t too complicated, commercial alternatives were limited and who wanted to add another royalty to further reduce… Read More
The Impact of AI on Software and Hardware Development
Part 4 of this series analyzes how AI algorithmic processing is transforming software structures and significantly modifying processing hardware. It explores the marginalization of the traditional CPU architecture and demonstrates how software is increasingly dominating… Read More
At the recent TSMC OIP Ecosystem Forum in Santa Clara, there was an important presentation that laid the groundwork for a great deal of future innovation. Alchip and its IP and EDA partner Synopsys presented Efficient 3D Chiplet Stacking Using TSMC SoIC. The concept of 3D, chiplet-based design certainly isn’t new. SemiWiki maintains… Read More
You begin writing some UVM code and there are parts of the code that aren’t done yet, so you begin to use uvm_objection, guarding that code. Rich Edelman, a product engineer at Siemens doing verification debug and analysis, wrote a paper on this topic, which I just read. This blog covers the topic of objections and provides some different… Read More
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