More Headwinds - CHIPS Act Chop? - Chip Equip Re-Shore? Orders Canceled & Fab Delay- CHIPS Act more likely to be maimed…Read More
Next Generation of Systems Design at SiemensElectronic systems design is filled with a wide…Read More
Samtec Paves the Way to Scalable Architectures at the AI Hardware & Edge AI SummitAI is exploding everywhere. We’ve all seen the…Read More
Tier1 Eye on Expanding Role in Automotive AIThe unsettled realities of modern automotive markets (BEV/HEV,…Read More
Designers choosing gallium nitride (GaN) transistors may face a surprising challenge when putting the devices in their context. While the Advanced SPICE Model for GaN HEMTs (ASM-HEMT) model captures many behaviors like thermal and trapping effects, it grapples with accuracy over a wide range of bias conditions. Foundries … Read More
– AMAT has OK QTR but outlook below expectations as 2025 weakens
– Strength in AI cannot offset weakness in the rest of the market
– Increasing headwinds going into 2025 dampen overall outlook
– Weakness combined with regulatory uncertainty reduce valuations
Dan is joined by Dr. Gaudenzio Meneghesso, IEDM 2024 Publicity Co-Chair, and Head of the Department of Information Engineering at the University of Padua in Italy.
Dan explores the program for the upcoming IEDM event with Gaudenzio. This conference covers a wide range of innovations that have significant impact on the semiconductor… Read More
– CHIPS Act more likely to be maimed & cut than outright killed
– Will Legislators reverse flow of equipment to Reshore from Offshore?
– Recent order cuts, Fab Delay & SMIC comments are all negative
– News flow for semi equipment all bad in front of AMAT
Sakya is the founder and Chief Executive officer of EdgeCortix. He is an artificial intelligence (AI) and machine learning technologist, entrepreneur, and engineer with over a decade of experience in taking cutting edge AI research from ideation stage to scalable products, across different industry verticals. He has lead… Read More
My first job out of college was migrating a DRAM chip from one process node to a newer node, and it was a 100% manual process that required many months of effort. That need to migrate semiconductor IP to newer nodes is still with us today, and much automation has been applied to digital circuits, however migrating analog IP has proven… Read More
Electronic systems design is filled with a wide range of tools used across IC packaging design, multi-board systems, design creation, physical implementation, electro-mechanical co-design, simulation & analysis, and new product introduction. Siemens has been offering tools in this flow for many years now, so I was able… Read More
AI is exploding everywhere. We’ve all seen the evidence. The same thing is happening with AI conferences. The conference I will discuss here began in 2018 as the AI Hardware Summit. The initial venue was the Computer History Museum in Mountain View, CA. Like most things AI, this conference has grown substantially in a relatively… Read More
The CHIPS and Science Act has allocated $11 billion for semiconductor R&D, including for advanced packaging and AI-driven design. Companies should apply now.
In 2022, the United States signed the $50 billion Chips and Science Act. Under the act, the National Institute of Standards and Technology (NIST), which is part of … Read More
The unsettled realities of modern automotive markets (BEV/HEV, ADAS/AD, radical views on how to make money) don’t only affect automakers. These disruptions also ripple down the supply chain prompting a game of musical chairs, each supplier aiming to maximize their chances of still having a chair (and a bigger chair) when the … Read More
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