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Everyone knows design complexity is exploding. What used to be difficult is now bordering on impossible. While design and verification challenges occupy a lot of the conversation, the problem is much bigger than this. The new design and manufacturing challenges of 3D innovations and the need to coordinate a much more complex … Read More
In the ever-evolving landscape of computing, Intel’s patent application for “Software Defined Super Cores” (EP 4 579 444 A1) represents a groundbreaking approach to enhancing processor performance without relying solely on hardware scaling. Filed in November 2024 with priority from a U.S. application… Read More
TSMC, the world’s most trusted semiconductor foundry, released its 2024 Sustainability Report, underscoring its commitment to embedding environmental, social, and governance principles into its operations. Founded in 1987 and headquartered in Hsinchu Science Park, TSMC employs 84,512 people globally and operates… Read More
Introduction by Lip-BU Tan:
I’m an engineer at heart. Nothing motivates me more than solving hard problems. Our teams across Intel are driven by this same mindset—inspired by the power of technology to enable new solutions to our customers’ toughest challenges.
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This press release from CAST announces a significant collaboration with RANiX Inc., highlighting the integration of CAST’s TSN Switch IP core into RANiX’s new Integrated Micro Flat Antenna System (IMFAS) SoC. This development underscores the growing adoption of Time-Sensitive Networking (TSN) in the automotive… Read More
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Today Alchip Technologies, a Taipei-based leader in high-performance and AI computing ASICs, announced a significant milestone with the successful tape-out of its 3D IC test chip. This achievement not only validates Alchip’s advanced 3D IC ecosystem but also positions the company as a frontrunner in the rapidly evolving field… Read More
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