The automotive semiconductor industry is undergoing a major architectural transition as vehicles evolve into centralized, software-defined computing platforms capable of supporting advanced driver assistance systems (ADAS), autonomous driving, and AI-enabled cockpit applications. This shift is driving demand for… Read More
Perforce Enabling Innovation Without Introducing Risk at DAC 2026Perforce delivers a DevOps Tech Stack for teams…Read More
Arteris at DAC 2026 Connecting Innovation for Silicon SuccessThe semiconductor industry has entered a new era…Read More
DAC 2026 Mach42: A new generation of physics-driven AI models for analog circuit verificationMach42 spun out of the Department of Physics…Read More
Synopsys at Design Automation Conference 2026Synopsys is catalyzing the era of pervasive intelligence…Read More
DAC 2026: Join Accellera for a dynamic luncheon exploring how artificial intelligence is reshaping the standards landscape for design and verification.Accellera Systems Initiative invites the design and verification…Read MorePowerArtist RTL Power Estimation Folds into Keysight
Back in the late 1990s, Sente launched a product called WattWatcher to estimate power from design RTL and simulation activity. This was revolutionary for its time since alternatives, while very accurate, only offered power analysis at the gate level. Gate-level analysis is great for fine-tuning power but is unhelpful for achieving… Read More
Intel Foundry Expands the 18A Platform with 18A-P and Demonstrates Long-Term Technology Leadership at VLSI 2026
At the 2026 VLSI Symposium, Intel Foundry provided a detailed update on its process technology roadmap, highlighting the continued maturation of Intel 18A, the introduction of Intel 18A-P, and several advanced research initiatives that extend beyond current gate-all-around (GAA) transistor architectures. The presentation… Read More
GPU-native mask rule checking eliminates the curvilinear mask rule check bottleneck
As semiconductor manufacturing pushes toward advanced nodes with tighter feature sizes, the optical proximity correction (OPC) workflow is adopting curvilinear masks to achieve the larger process windows that traditional Manhattan geometries cannot deliver.
Traditional Manhattan masks constrain shapes to vertical … Read More
A tower-like heterogeneous packaging architecture for the AI era
For years, advanced packaging has been described mostly in planar terms: chiplets placed side by side, connected through interposers, bridges, redistribution layers, substrates, and short-reach electrical links. This view remains important. It supports today’s GPU, HBM, chiplet, and 2.5D integration architectures.… Read More
Akeana Collaborates with Samsung Electronics, Fast-Tracking RISC-V Customers and Ecosystem for Server and Agentic AI Silicon
The momentum behind RISC-V continues to accelerate as Akeana announced a strategic collaboration with Samsung Electronics aimed at reducing time-to-market for next-generation server and agentic AI silicon. The partnership combines Akeana’s high-performance RISC-V compute platform with Samsung Foundry’s advanced process… Read More
Chips&Media’s Next-Generation Video CODEC IP Powers Ambarella’s Expanding Edge AI Portfolio
Chips&Media has announced a strategic licensing agreement with Ambarella for its latest-generation video CODEC intellectual property (IP), marking a significant milestone in the evolution of edge AI, computer vision, and physical AI systems. The agreement follows an extensive technical evaluation process and further… Read More
Agentic AI and the Future of Chip Design: From Productivity Tool to Engineering Partner
Highlights from a recent panel session moderated by Ed Sperling (Semiconductor Engineering) featuring Walden Rhines (Silvaco), Vincent Wong (Verific), Dave Kelf (Breker Verification Systems), Shelly Henry (MooresLab AI), Ann Wu (Silimate), and Cindy Cui (ChipAgents). The panel session was hosted by Electronic System … Read More
CEO Interview with Suresh Vasudevan of Clockwork.io
Suresh Vasudevan is CEO of Clockwork.io, pioneering Software-Driven AI Fabrics™ that recover the 60-80% of cluster capacity that today goes completely unutilized. Previously, he led Nimble Storage to IPO and HPE acquisition, and served as CEO of Sysdig. Prior to that, he was at NetApp and McKinsey & Co.
His focus: making … Read More
Q&A Interview with Mo Steinman, Lightelligence’s Senior Vice President and General Manager, U.S.
Maurice (Mo) Steinman is Senior Vice President and General Manager, U.S. at Lightelligence. He took a few minutes out of a busy week to answer questions about Lightelligence, its optical solutions, application areas for its optical computing products and how it differentiates itself in this market.


TSMC CoWoS versus Intel EMIB Semiconductor Packaging