Bird’s Eye View Magic: Cadence Tensilica Product Group Pulls Back the CurtainEven for experienced technologists some technologies can seem…Read More
Siemens EDA Offers a Comprehensive Guide to PCIe® Transport SecurityIt is well-known that there is more data…Read More
Semiconductor Industry Update: Fair Winds and Following Seas!Malcolm Penn did a great job on his…Read More
Benjamin Franklin, “I didn’t fail the test, I just found 100 ways to do it wrong.” I was reminded of this line during a joint Mentor-ARM seminar yesterday about testing ARM cores and memories. The complexity of testing modern SoC designs at advanced nodes, with multiple integrated ARM cores and other IP, opens up plenty of room for… Read More
The press has been buzzing about 3D everything for the past few years, so when it comes to IC design it’s a fair question to ask how would you actually extract 3D IC structures for use by analysis tools like a circuit simulator. I read a white paper by Christen Decoin and Vassilis Kourkoulos of Mentor Graphics this week and became… Read More
EDAC announced that EDA industry revenue increased 6.3% for Q1 2012 to $1536.9M compared to a year ago. Sequentially it declined, as it normally does from Q4 to Q1, by 9.6%. Every category except services increased revenue and every region increased revenue except for Japan. The full report is available by subscription, of course.… Read More
This is really the second part to this blog about the challenges of EUV lithography. The next speaker was Franklin Kalk who is CTO of Toppan Photomasks. He too emphasized that we can make almost arbitrarily small features but more and more masks are required (not, that I suspect, he would complain being in the mask business). For EUV… Read More
Have you seen the latest design rule manuals? At 28nm and 20nm design sign-off is no longer just DRC and LVS. These basic components of physical verification are being augmented by an expansive set of yield analysis and critical feature identification capabilities, as well as layout enhancements, printability, and performance… Read More
Matt Elmore of ANSYS/Apache has an interesting blog posting about thermal analysis in 3D integrated circuits. With both technical and economic challenges at process nodes as we push below 28nm, increasingly product groups are looking towards through-silicon-via (TSV) based approaches as a way of keeping Moore’s law… Read More
Last month at DAC I learned how IBM, Cadence, ARM, GLOBALFOUNDRIES and Samsung approach the challenges of SoC design, EDA design and fabrication at the 20nm node. Today I followed up by reading a white paper on 20nm IC design challenges authored by Cadence, a welcome relief to the previous marketing mantra of EDA 360.
Here’s… Read More
Over the years many attempts have been made to increase the level of automation in analog design. Most of these have not been especially successful. Probably part of the reason was inadequate technology but also there is an attitude that “real” analog designers design polygons on the bare silicon. I think two things… Read More
Qualcomm has a nice problem to have: too much demand for its Snapdragon and 4G LTE baseband parts. How Qualcomm realigns its manufacturing strategy around this problem will determine whether or not they can breakaway from the ARM camp and go toe to toe with Intel. Last week Malcolm Penn claimed TSMC was too big to fail. Really? The … Read More
EUV is the great hope for avoiding having to go to triple (and more) patterning if we have to stick with 193nm light. There were several presentations at Semicon about the status of EUV. Here I’ll discuss the issues with EUV lithography and in a separate post discuss the issues about making masks for EUV.
It is probably worth … Read More
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