The emerging theme of fit-for-purpose IoT parts gained yet another perspective, this time with ARM and CEVA chiming in on a low-power Wi-Fi approach outlined in a new webinar. It was a rather unique event with an abbreviated 25-minute presentation and an extended 35-minute Q&A that added a lot of insight.… Read More
Perforce and Siemens Collaborate on 3DIC Design at the Chiplet SummitThe recent Chiplet Summit at the Santa Clara…Read More
Building the Interconnect Foundation: Bump and TSV Planning for Multi-Die SystemsThe first article in this series examined how…Read More
CHERI: Hardware-Enforced Capability Architecture for Systematic Memory SafetyThe rapid escalation of cyberattacks over the past…Read More
WEBINAR: Two-Part Series on RF Power Amplifier DesignAt lower frequencies with simpler modulation, RF power…Read More
Securing RISC-V Third-Party IP: Enabling Comprehensive CWE-Based Assurance Across the Design Supply Chainby Jagadish Nayak RISC-V adoption continues to accelerate…Read More
Wearables Mean Continuous Growth in the Internet of Things Ecosystem
The Internet of Things encompasses a wide range of connected services, technologies, and hardware devices. Yet, for consumers, it is the growing number of portable and wearable devices that will be their main interface with IOT tech. The wearable device market is rapidly evolving, especially when it comes to smart watches and… Read More
“Thinking Outside the Chip”
While pushing Moore’s Law’s boundaries in the world of 2D packaging, companies are starting to explore nontraditional approaches towards designing integrated circuit chips. 2D packaging is currently the most used method in designing chips in the industry, and while it leads in efficiency of power and performance, it lacks … Read More
EUV is coming but will we need it?
I have written multiple articles about this year’s SPIE Advanced Lithography Conference describing all of the progress EUV has made in the last year. Source power is improving, photoresists are getting faster, prototype pellicles are in testing, multiple sites around the world are exposing wafers by the thousands and more. … Read More
Making PLM Actually Work for for IC Design
The topic of Product Lifecycle Management (PLM) conjures up images of usage on airplanes, tanks and cars. That’s because it was developed decades ago to help make product development and delivery more efficient for big expensive manufactured products. It worked well for its intended markets by combining and managing all the … Read More
Multiple Facets of Cyber Security Workshop!
Security is one of the new categories we track and it is keeping SemiWiki very busy. Security in itself, as a result of the FBI vs Apple comedy routine, but also security across the EDA, IP, ARM, Mobile, IoT, and Automotive categories. … Read More
2.5D supply chain takes HBM over the wall
SoC designers have hit the memory wall head on. Although most SoCs address a relatively small memory capacity compared with PC and server chips, memory power consumption and bandwidth are struggling to keep up with processing and content expectations. A recent webinar looks at HBM as a possible solution.… Read More
Neural Networks Poised to Make Big Changes in Our World
Probably the most interesting thing about Neural Networks is how they can be used for complex recognition tasks that we as people can easily perform but we might have a lot of trouble explaining how. One very good example of a problem that Neural Networks can tackle is determining when people are making a fake smile. Intuitively we… Read More
Custom Layout Productivity Gets a Boost
In the 1970’s, when Moore’s Law was still in its infancy, Bill Lattin from Intel published a landmark paper [1]. In it he identified the need for new design tools and methods to improve layout productivity, which he defined as the drawn and verified number of transistors per day per layout designer. He said existing … Read More
Silicon Photonics – Back to the Future – Part Deux?
I cut my teeth in silicon IC design at Texas Instruments during the early 1980’s working on what would eventually become the ASIC and Fabless IC industries that enabled the explosive growth of the electronics industry over the last three decades. Of late I’ve become involved in the silicon photonics space and I am getting an incredible… Read More
CEO Interview with Jerome Paye of TAU Systems