In today’s rapidly evolving digital landscape, the security of electronic systems is of the highest priority. This importance is underscored by technological advancements and increasing regulatory demands. Multi-die designs which integrate multiple dies (also called chiplets) into a single package, introduce … Read More
I’ve watched the EDA industry change the level of design abstraction starting from transistor-level to gate-level, then RTL, and finally using High Level Synthesis (HLS). Another emerging software trend is the use of generative AI to make coding RTL more automated. There’s a new EDA company called Rise Design Automation that… Read More
by, Tomi Rantakari CEO ChipFlow & Luca Testa COO Keysom
The automotive industry is undergoing a major transformation, driven by electrification, the rise of new market players, and the rapid adoption of emerging technologies such as AI. Among the most significant advancements is the growing adoption of RISC-V, an open-standard… Read More
The annual SNUG (Synopsys Users Group) conference, now in its 35th year, once again brought together key stakeholders to showcase accomplishments, discuss challenges, and explore opportunities within the semiconductor and electronics industry. With approximately 2,500 attendees, SNUG 2025 served as a dynamic hub for collaboration… Read More
Dan is joined by Marc Evans, director of business development and technology at Andes. Marc has over twenty years of experience in the use of CPU, DSP, and Specialized IP in SoCs from his prior positions at Lattice Semiconductor, Ceva, and Tensilica. During his early career, Marc was a processor architect, making significant contributions… Read More
With over 25 years of international experience in the high-tech sector, Pierre Laboisse now leads Aledia with strategic expertise. Before Aledia, he made significant contributions at Infineon, NXP, and ams OSRAM. Having served on the boards of KeyLemon and 7 Sensing Software, he demonstrates solid expertise in corporate strategy… Read More
In a DRAM chip, the memory array contains features which are the most densely packed, but at least they are regularly arranged. Outside the array, the regularity is lost, but in the most difficult cases, the pitches can still be comparable with those within the array, though generally larger. Such features include the lowest metal… Read More
We started working with Alphawave at the end of 2020 with a CEO Interview. I had met Tony Pialis before and found him to be a brilliant and charismatic leader so I knew it would be a great collaboration. Tony was already an IP legend after his company was acquired by Intel. After 4+ years at Intel Tony co-founded Alphawave in 2017. Today,… Read More
Why Latency-Tolerant Architectures Matter in the Age of AI Supercomputing
High Bandwidth Memory (HBM) has become the defining enabler of modern AI accelerators. From NVIDIA’s GB200 Ultra to AMD’s MI400, every new AI chip boasts faster and larger stacks of HBM, pushing memory bandwidth into the terabytes-per-second range. … Read More
Dan is joined by Jon Ames, principal product manager for the Synopsys Ethernet IP portfolio. Jon has been working in the communications industry since 1988 and has led engineering and marketing activities from the early days of switched Ethernet to the latest data center and high-performance computing Ethernet technologies.… Read More
Intel’s Path to Technological Leadership: Transforming Foundry Services and Embracing AI