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Silicon Insurance: Why eFPGA is Cheaper Than a Respin — and Why It Matters in the Intel 18A Era

Silicon Insurance: Why eFPGA is Cheaper Than a Respin — and Why It Matters in the Intel 18A Era
by Daniel Nenni on 03-26-2026 at 10:00 am

Silicon Insurance Why eFPGA is Cheaper Than a Respin

As semiconductor technology advances into increasingly complex and expensive process nodes, the economic and technical risks associated with ASIC design have grown dramatically. At advanced nodes such as Intel 18A, the cost of a single design error can escalate into tens of millions of dollars, compounded by months of delay.… Read More


Synopsys Advances Hardware Assisted Verification for the AI Era

Synopsys Advances Hardware Assisted Verification for the AI Era
by Kalar Rajendiran on 03-26-2026 at 6:00 am

Software Defined HAV, Scalability, Density, Performance and EP Ready Hardware

At the 2026 Synopsys Converge Event, Synopsys announced a broad set of new products and platform upgrades, with its hardware-assisted verification (HAV) announcement emerging as a key highlight within that lineup. A key aspect of this announcement was moving beyond a hardware centric model to a more scalable, programmable … Read More


Chemical Origins of Environmental Modifications to MOR Lithographic Chemistry

Chemical Origins of Environmental Modifications to MOR Lithographic Chemistry
by Daniel Nenni on 03-25-2026 at 10:00 am

Chemical Origins of Environmental Modifications to MOR Lithographic Chemistry

In the pursuit of advanced extreme ultraviolet (EUV) lithography for high-NA patterning, metal oxide resists (MORs) offer significant promise but face challenges like critical dimension (CD) variation due to atmospheric interactions. Presented at SPIE Advanced Lithography + Patterning 2025 by Kevin M. Dorney and colleagues… Read More


Post-Silicon Validating an MMU. Innovation in Verification

Post-Silicon Validating an MMU. Innovation in Verification
by Bernard Murphy on 03-25-2026 at 6:00 am

Innovation New

Some post-silicon bugs are unavoidable, but we’re getting better at catching them before we ship. Here we look at a method based on a bare-metal exerciser to stress-test the MMU. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A)… Read More


Securing UALink in AI clusters with UALinkSec-compliant IP

Securing UALink in AI clusters with UALinkSec-compliant IP
by Don Dingee on 03-24-2026 at 10:00 am

UALinkSec 200 Security Module block diagram

A classic networking problem is securing connections with encrypted data, but implementing strong encryption algorithms at wire speeds can limit performance. However, introducing blazing-fast connectivity without an encryption strategy leaves systems vulnerable. The architects in the UALink Consortium, including … Read More


GTC 2026: Agentic AI for Semiconductor Design and Manufacturing

GTC 2026: Agentic AI for Semiconductor Design and Manufacturing
by Daniel Nenni on 03-24-2026 at 8:00 am

Agentic AI is emerging as a transformative paradigm in semiconductor design and manufacturing, driven by the exponential growth in data, system complexity, and performance demands. Modern semiconductor fabs generate massive volumes of heterogeneous data at unprecedented velocity. For instance, a single minute of operation

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Trust in Verification with AI

Trust in Verification with AI
by Bernard Murphy on 03-24-2026 at 6:00 am

Uncharted waters

These are stressful times in functional verification. We are being pushed to more aggressively embrace AI-based automation, knowing we will continue to be held accountable for quality of results. Verification misses could upend careers, maybe enterprises. It is tempting to believe that sanity will prevail and we will ultimately… Read More


Scaling Multi-Die Connectivity: Automated Routing for High-Speed Interfaces

Scaling Multi-Die Connectivity: Automated Routing for High-Speed Interfaces
by Kalar Rajendiran on 03-23-2026 at 10:00 am

Bump maps for HBM PHY and HBM memory

This article concludes the three-part series examining key methodologies required for successful multi-die design. The first article Reducing Risk Early: Multi-Die Design Feasibility Exploration focused on feasibility exploration and early architectural validation, while the second article Building the InterconnectRead More


Beyond Moore’s Law: High NA EUV Lithography Redefines Advanced Chip Manufacturing

Beyond Moore’s Law: High NA EUV Lithography Redefines Advanced Chip Manufacturing
by Daniel Nenni on 03-23-2026 at 8:00 am

DSC00975

The imec installation of the ASML EXE:5200 High Numerical Aperture (High NA) extreme ultraviolet (EUV) lithography system at imec represents a pivotal advancement in semiconductor manufacturing and research. This system, installed in imec’s 300 mm cleanroom in Leuven, Belgium, introduces unprecedented lithographic resolution… Read More


Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet Summit

Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet Summit
by Mike Gianfagna on 03-23-2026 at 6:00 am

Arteris Highlights a Path to Scalable Multi Die Systems at the Chiplet Summit

At the recent Chiplet Summit, presentations, discussions and general participation could be broken down into a few broad categories. There were presentations of actual chiplet designs, either as building blocks or end products. There were presentations regarding design tools and methodologies to support and accelerate … Read More