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WEBINAR: HBM4E Advances Bandwidth Performance for AI Training

WEBINAR: HBM4E Advances Bandwidth Performance for AI Training
by Don Dingee on 03-19-2026 at 10:00 am

HBM advantage in AI training

The rapid proliferation of LLMs and other AI applications, and of high-end GPU platforms that run them, is putting intense pressure on the performance requirements for memory technologies. Designers need to be keenly aware of how to make the most of their memory and controller choices, which can be moving targets given the rapid… Read More


Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design Enablement

Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design Enablement
by Mike Gianfagna on 03-19-2026 at 8:00 am

Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Enablement

The recent Chiplet Summit in Santa Clara was buzzing with new designs and new design methods. It felt like the industry had turned a corner at this year’s event with lots of new technology and design success on display. Siemens EDA had a large presence at the show and took home the Best in Show Award for Packaging Design. There were a … Read More


Siemens Fuse EDA AI Agent Releases to Orchestrate Agentic Semiconductor and PCB Design

Siemens Fuse EDA AI Agent Releases to Orchestrate Agentic Semiconductor and PCB Design
by Bernard Murphy on 03-19-2026 at 6:00 am

Fuse Agentic System

Though terminology sometimes get fuzzy, consensus holds that an agent manages a bounded task with control through a natural language interface. An agentic orchestrator, itself an agent, manages a more complex objective requiring reasoning through multi-step actions and is responsible for orchestrating those actions. By… Read More


Accelerating Computational Lithography Using Massively Parallel GPU Rasterizer

Accelerating Computational Lithography Using Massively Parallel GPU Rasterizer
by Kalar Rajendiran on 03-18-2026 at 10:00 am

Rasterization Polygon to pixel based representation

As semiconductor manufacturing pushes deeper into the nanometer regime, computational lithography has evolved from a supporting step into a central pillar of advanced chip design. Mask synthesis, lithography simulation, and optical proximity correction (OPC) now demand unprecedented levels of accuracy and computational… Read More


Verification Analytics: The New Paradigm with Cogita-PRO at DVCON 2026

Verification Analytics: The New Paradigm with Cogita-PRO at DVCON 2026
by Daniel Nenni on 03-18-2026 at 8:00 am

The Cogita PRO Paradigm

Cogita-PRO, developed by Vtool, introduces a transformative approach to design verification by treating it as a big data challenge rather than a traditional debugging exercise. Released in February 2026, this tool shifts the focus from manual log and waveform inspection to advanced verification analytics powered by data … Read More


Breker Hosts an Energetic Panel on Spec-Driven Verification

Breker Hosts an Energetic Panel on Spec-Driven Verification
by Bernard Murphy on 03-18-2026 at 6:00 am

Energetic panel on AI in verification

I was fortunate to be asked to moderate an evening panel adjacent to the first day of DVCon 2026, on AI-Driven SoC Verification starting from specs. You know my skepticism on panels, finding they rarely generate insights or controversy. This panel was quite different. Panelists were Shelley Henry (CEO, Moores Lab AI), Adnan Hamid… Read More


Formal Verification Best Practices

Formal Verification Best Practices
by Daniel Payne on 03-17-2026 at 10:00 am

formal verification

How do I know when my hardware design is correct and meets all of the specifications? For many years the answer was simple, simulate as much as you can in the time allowed in the schedule and then hope for the best when silicon arrives for testing. There is a complementary method for ensuring that hardware design meets the specifications… Read More


WEBINAR: Reclaiming Clock Margin at 3nm and Below

WEBINAR: Reclaiming Clock Margin at 3nm and Below
by Daniel Nenni on 03-17-2026 at 8:00 am

Webinar Blog Image Reclaiming Clock Margin

At 3nm and below, clock networks have quietly become the dominant limiter of SoC power, performance, and yield. Yet most advanced-node designs still rely on abstraction-based signoff methodologies developed when voltage headroom was generous and interconnect effects were secondary.

That assumption no longer holds

As supply… Read More


The First Real RISC-V AI Laptop

The First Real RISC-V AI Laptop
by Jonah McLeod on 03-17-2026 at 6:00 am

DC ROMA

At a workshop in Boston on February 27, something subtle but important happened. Developers sat down in front of a RISC-V laptop, installed Fedora, and ran a local large language model. No simulation. No dev board tethered to a monitor. A laptop.

For more than a decade, RISC-V advocates have promised that the open instruction set… Read More


AI-Driven Automation in Semiconductor Design: The Fuse EDA AI Agent

AI-Driven Automation in Semiconductor Design: The Fuse EDA AI Agent
by Daniel Nenni on 03-16-2026 at 1:30 pm

The semiconductor industry is experiencing unprecedented growth in complexity as advanced process nodes, heterogeneous integration, and AI-driven workloads demand increasingly sophisticated chip designs. At the same time, semiconductor companies face rising design costs, increasing engineering workloads, and a shrinking… Read More