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Relationships with IP Vendors

Relationships with IP Vendors
by Daniel Nenni on 11-21-2024 at 10:00 am

Semiwiki Blog Post #3 Image #2

An animated panel discussion Design Automation Conference in June offered up a view of the state of RISC-V and open-source functional verification and a wealth of good material for a three-part blog post series.

Parts One and Two covered a range of topics from microcontroller versus more general-purpose processor versus running… Read More


Silicon Creations is Fueling Next Generation Chips

Silicon Creations is Fueling Next Generation Chips
by Mike Gianfagna on 11-21-2024 at 6:00 am

Silicon Creations is Fueling Next Generation Chips

Next generation semiconductor design puts new stress on traditionally low-key parts of the design process. One example is packaging, which used to be the clean-up spot at the end of the design. Thanks to chiplet-based design, package engineers are now rock stars. Analog design is another one of those disciplines.

Not long ago,… Read More


I will see you at the Substrate Vision Summit in Santa Clara

I will see you at the Substrate Vision Summit in Santa Clara
by Daniel Nenni on 11-20-2024 at 10:00 am

Soitec Substrate Vision Summit

WIth packaging being one of the top sources of traffic on SemiWiki, I am expecting a big crowd at this event. A semiconductor substrate is a foundational material used in the fabrication of semiconductor devices. Substrates are a critical part of the manufacturing process and directly affect the performance, reliability, and… Read More


Get Ready for a Shakeout in Edge NPUs

Get Ready for a Shakeout in Edge NPUs
by Bernard Murphy on 11-20-2024 at 6:00 am

trackstar in a race min (1)

When the potential for AI at the edge first fired our imagination, semiconductor designers recognized that performance (and low power) required an accelerator and many decided to build their own. Requirements weren’t too complicated, commercial alternatives were limited and who wanted to add another royalty to further reduce… Read More


The Immensity of Software Development and the Challenges of Debugging Series (Part 4 of 4)

The Immensity of Software Development and the Challenges of Debugging Series (Part 4 of 4)
by Lauro Rizzatti on 11-19-2024 at 10:00 am

Immensity of SW development Part 4 Table 1

The Impact of AI on Software and Hardware Development

Part 4 of this series analyzes how AI algorithmic processing is transforming software structures and significantly modifying processing hardware. It explores the marginalization of the traditional CPU architecture and demonstrates how software is increasingly dominatingRead More


Alchip is Paving the Way to Future 3D Design Innovation

Alchip is Paving the Way to Future 3D Design Innovation
by Mike Gianfagna on 11-19-2024 at 6:00 am

Alchip is Paving the Way to Future 3D Design Innovation

At the recent TSMC OIP Ecosystem Forum in Santa Clara, there was an important presentation that laid the groundwork for a great deal of future innovation. Alchip and its IP and EDA partner Synopsys presented Efficient 3D Chiplet Stacking Using TSMC SoIC. The concept of 3D, chiplet-based design certainly isn’t new. SemiWiki maintains… Read More


Handling Objections in UVM Code

Handling Objections in UVM Code
by Daniel Payne on 11-18-2024 at 10:00 am

expanded view min

You begin writing some UVM code and there are parts of the code that aren’t done yet, so you begin to use uvm_objection, guarding that code. Rich Edelman, a product engineer at Siemens doing verification debug and analysis, wrote a paper on this topic, which I just read. This blog covers the topic of objections and provides some different… Read More


GaN HEMT modeling with ANN parameters targets extensibility

GaN HEMT modeling with ANN parameters targets extensibility
by Don Dingee on 11-18-2024 at 6:00 am

Modified ASM HEMT equivalent circuit for GaN HEMT modeling with ANN parameters

Designers choosing gallium nitride (GaN) transistors may face a surprising challenge when putting the devices in their context. While the Advanced SPICE Model for GaN HEMTs (ASM-HEMT) model captures many behaviors like thermal and trapping effects, it grapples with accuracy over a wide range of bias conditions. Foundries … Read More


AMAT has OK Qtr but Mixed Outlook Means Weaker 2025 – China & Delays & CHIPS Act?

AMAT has OK Qtr but Mixed Outlook Means Weaker 2025 – China & Delays & CHIPS Act?
by Robert Maire on 11-17-2024 at 8:00 am

Applied Materials

– AMAT has OK QTR but outlook below expectations as 2025 weakens
– Strength in AI cannot offset weakness in the rest of the market
– Increasing headwinds going into 2025 dampen overall outlook
– Weakness combined with regulatory uncertainty reduce valuations

Quarter and year are just OK but outlook is
Read More

Podcast EP261: An Overview of the Upcoming 70th IEDM with Dr. Gaudenzio Meneghesso

Podcast EP261: An Overview of the Upcoming 70th IEDM with Dr. Gaudenzio Meneghesso
by Daniel Nenni on 11-15-2024 at 9:00 am

Dan is joined by Dr. Gaudenzio Meneghesso, IEDM 2024 Publicity Co-Chair, and Head of the Department of Information Engineering at the University of Padua in Italy.

Dan explores the program for the upcoming IEDM event with Gaudenzio. This conference covers a wide range of innovations that have significant impact on the semiconductor… Read More