IEDM Opens with a Big Picture Keynote from TSMC’s Yuh-Jier MiiThe main program for the 70th IEDM opened…Read More
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Accellera 2024 End of Year UpdateFrom my viewpoint, standards organizations in semiconductor design…Read More
2.5D and 3D multi-die design is rapidly moving into the mainstream for many applications. HPC, GPU, mobile, and AI/ML are application areas that have seen real benefits. The concept of “mix/match” for chips and chiplets to form a complex system sounds deceptively simple. In fact, the implementation and analysis techniques required… Read More
SystemC version 1.0 came out in 2000 as a C++ class library for system-level modeling and simulation, and on SemiWiki.com there are some 497 references to the language. I wanted to provide an update in this blog so that engineering teams can become more efficient in using SystemC on their SoC projects, saving time and improving product… Read More
At the heart of the shift-left strategy is the goal of moving traditionally late-stage tasks—such as software development, validation, and optimization—earlier in the design process. This proactive approach allows teams to identify and resolve issues before they escalate, reducing costly rework and shortening the overall… Read More
RISC-V cores are popping up everywhere. The growth of this open instruction set architecture (ISA) was quite evident at the recent RISC-V summit. You can check out some of the RISC-V buzz on SemiWiki here. While all this is quite exciting and encouraging, there are hurdles to face before true prime-time, ubiquitous application… Read More
Sondrel has just appointed a new CEO, Ollie Jones, so we had a chat with him to find out his vision for the company.
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3D-IC design can be both exciting and frustrating. It’s exciting because it opens a new world of innovation possibilities – opportunities that aren’t constrained by the rules of monolithic chip scaling. It can be frustrating because of the large array of complex technical challenges that must be overcome to make this new paradigm… Read More
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