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KLAC- Very Strong Sept & Guide-Foundry up 50%- 5NM & EUV drivers- Outperforming

KLAC- Very Strong Sept & Guide-Foundry up 50%- 5NM & EUV drivers- Outperforming
by Robert Maire on 11-05-2019 at 6:00 am

  • KLAC Strong Beat on Both Sept Q & Dec Guide
  • Foundry/logic (TSMC) up 50% H2 vs H1
  • Gen 5 acceptance and 5NM rollout drive future

Strong beat in Sept results and Dec Guide
KLAC reported revenue of $1.41B and EPS of $2.48 handily beating street estimates of $1.5B and $2.20 in EPS. More importantly the company guided December to be revenues… Read More


Achronix Announces New Accelerator Card at Linley Fall Processor Conference – VectorPath

Achronix Announces New Accelerator Card at Linley Fall Processor Conference – VectorPath
by Randy Smith on 11-04-2019 at 10:00 am

This blog is my second blog from this year’s Linley Fall Processor Conference. The first two blogs focused on edge inference solutions. Achronix’s discussion was much broader than just AI/ML; it was about where FPGA’s have been going and culminated with a product announcement preview. I’ll get to the announcement in a moment, … Read More


Intel CEO Update Q4 2019

Intel CEO Update Q4 2019
by Daniel Nenni on 11-04-2019 at 6:00 am

Bob Swan started as interim CEO in June of 2018 and took the full-time CEO job in January of 2019. I was a vocal critic of the previous CEO Brian Krzanich (BK) and really felt he was not fit to serve. As it turns out I was right. It is not just the CEO himself, but also the people that he surrounds himself with. BK surrounded himself with the… Read More


Shipments of 5G Smartphones Will Surge to 900 Million Units in 2024

Shipments of 5G Smartphones Will Surge to 900 Million Units in 2024
by Robert Castellano on 11-03-2019 at 6:00 am

5G smartphones will increase from just 13 million units in 2019 to 900 million in 2024, as previous 2G/3G/4G smartphones shipments will decline slightly over the 2019-2024 period, reaching parity with 5G smartphones in 3Q 2023, as shown in the chart below.

According to The Information Network’s report “Hot ICs: Read More


VW Drops Connected Car Bombshell

VW Drops Connected Car Bombshell
by Roger C. Lanctot on 11-03-2019 at 6:00 am

A senior executive from Volkswagen North America kicked off Enterprise Ireland’s first annual “CASE: Driving the Future” mobility symposium last week with the announcement of the launch of its next generation Car-Net connected car platform. The new solution represents a breakthrough by allowing for the customer selection

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AMD Intel TSMC menage a trois and the trouble with trouples

AMD Intel TSMC menage a trois and the trouble with trouples
by Robert Maire on 11-01-2019 at 10:00 am

  • Its “Complicated”- A 3 way Chip Relationship
  • Competing for Wafers, Moore’s Law & Love
  • Who’s Competing with Whom?
  • All’s Fair

The 3 way relationship is more complex than it seems

On the surface it seems simple. AMD and TSMC compete with Intel making its own chips and TSMC making them for AMD. But… Read More


Samsung 2019 Technology Day Recap!

Samsung 2019 Technology Day Recap!
by Daniel Nenni on 11-01-2019 at 6:00 am

Samsung is a complicated company with a VERY long history. We attempted to capture the Samsung Experience in chapter 8 of our book “Mobile Unleashed: The Origin and Evolution of ARM Processors In Our Devices”. If you are a registered SemiWiki member you can download a free PDF copy in our Books section.

Here is the chapter 8 … Read More


BittWare PCIe server card employs high throughput AI/ML optimized 7nm FPGA

BittWare PCIe server card employs high throughput AI/ML optimized 7nm FPGA
by Tom Simon on 10-31-2019 at 6:00 am

Back in May I wrote an article on the new Speedster7t from Achronix. This chip brings together Network on Chip (NoC) interconnect, high speed Ethernet and memory connections, and processing elements optimized for AI/ML. Speedster7t is a very exciting new FPGA that can be used effectively to accelerate a wide range of processing… Read More


Efficiency – Flex Logix’s Update on InferX™ X1 Edge Inference Co-Processor

Efficiency – Flex Logix’s Update on InferX™ X1 Edge Inference Co-Processor
by Randy Smith on 10-30-2019 at 10:00 am

Last week I attended the Linley Fall Processor Conference held in Santa Clara, CA. This blog is the first of three blogs I will be writing based on things I saw and heard at the event.

In April, Flex Logix announced its InferX X1 edge inference co-processor. At that time, Flex Logix announced that the IP would be available and that a chip,… Read More


Arm Reveals Custom Instructions, Mbed Partner Governance

Arm Reveals Custom Instructions, Mbed Partner Governance
by Bernard Murphy on 10-30-2019 at 6:00 am

Tipping the scale

At TechCon Arm announced two more advances against competitive threats, one arguably tactical and the other strategic, at least in this writer’s view.  The tactical move was to add support for custom instructions, the ability to collapse multiple instructions into a single instruction through customer-added logic which hooks… Read More