I have been watching the trend for quite some time now that many advanced FinFET designs today are actually 2.5D systems in package. All of these 2.5D silicon interposer-based designs have high-bandwidth memory (HBM) stacks on board. Often there are multiple memory stacks in both 4-high and 8-high configurations. If you follow… Read More





Talking Sense With Moortec…Are You Listening?!
It almost doesn’t matter what your job may be, whether in the public sector or a private company, or how technical or how dangerous, many of life’s adages and sayings can be interpreted to have some direct meaning for all of us.
Over the years in our personal lives, we have been constantly advised that prevention is better than cure…certainly… Read More
Linux for Medical Devices Q&A
As I have mentioned before SemiWiki gets to meet some very smart people and here is another one. Scot Morrison has an MS degree in Aerospace Engineering from MIT specializing in control systems. Today he is the general manager of the Embedded Platform Solutions Division at Mentor, a Siemens business. Scot oversees the Linux®, Nucleus®,… Read More
Is Chip Embargo aimed at China, Huawei, TSMC or all three?
Is TSMC the real target, not just collateral damage?
Is equipment embargo threat to bring TSMC to heel?
Is an embargo a “Trifecta” of US strategic goals?
Maybe TSMC is a real target of chip equipment embargo not just potential collateral damage
It occurs to us when we talk about TSMC being caught in the middle between … Read More
Covid Created Collateral China Crisis
Economic damage-
China relationship damage will far outlast direct Covid19 logistics impact-
Economic damage could be huge but trade damage could be larger with more specific impact on chips-
A long build up to a China trade nuclear winter, the “drum-beat of war”
When we started talking about a potential chip trade… Read More
TSMC’s Advanced IC Packaging Solutions
TSMC as Pure Play Wafer Foundry
TSMC started its wafer foundry business more than 30 years ago. Visionary management and creative engineering teams developed leading-edge process technologies and their reputation as trusted source for high-volume production. TSMC also recognized very early the importance of building an … Read More
Lithography Resolution Limits: Line End Gaps
In a previous article [1], the Rayleigh criterion was mentioned as the resolution limit for the distance between two features. On the other hand, in a following article [2], the minimum pitch was mentioned for the resolution limit for arrayed features. In this article, we reconcile the two by considering gaps between arrayed features,… Read More
Slash Tapeout Times with Calibre in the Cloud
I’ve spent many years in the ASIC business, and I’ve seen my share of complex chip tapeouts. All of these projects share one important challenge – compute requirements explode when you get close to the finish line. Certain tools need to run on the full-chip layout for final verification and the run times for those tools can get excessively… Read More
Radiation Tolerance. Not Just for ISO 26262
Years before ISO 26262 (the auto safety standard) existed, a few electronics engineers had to worry about radiation hardening, but not for cars. Their concerns were the same we have today – radiation-induced single event effects (SEE) and single event upsets (SEU). SEEs are root-cause effects – some form of radiation, might be… Read More
Can TSMC Maintain Their Process Technology Lead
Recently Seeking Alpha published an article “Taiwan Semiconductor Manufacturing Company Losing Its Process Leadership To Intel” and Dan Nenni (SemiWiki founder) asked me to take a look at the article and do my own analysis. This is a subject I have followed and published on for many years.
Before I dig into specific process density… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet