Ethernet speed evolution has kept a nice pace over the years even without any competing communications standard. And there are no signs of that slowing down, thanks to innovative companies deploying creative design techniques to keep delivering high-performance SerDes IP solutions. SerDes plays an integral role in implementing… Read More
Agentrys a New Paradigm for Semiconductor Engineering at 2026 DACAgentrys is pioneering Agentic Design Automation (ADA), a new…Read More
PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI ConnectivityPCI Express (PCIe), PCIe switches, Time Division Multiplexing…Read More
DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!Analog Bits, Inc. is an established provider of…Read More
Perforce Enabling Innovation Without Introducing Risk at DAC 2026Perforce delivers a DevOps Tech Stack for teams…Read More
Arteris at DAC 2026 Connecting Innovation for Silicon SuccessThe semiconductor industry has entered a new era…Read MoreMore Tales from the NoC Trenches
Science texts like to present the evolution of knowledge as step-function transitions, from ignorance to wisdom. We used to think the sun revolved around the earth. Then Galileo appeared, and we instantly realized that the earth revolves around the sun. But reality is always messier, as Galileo understood all too well. The transition… Read More
Webinar: PICMG COM-HPC® – New Open Standard for High Performance Compute Modules
The subject of this webinar is focused on the new COM-HPC standard from PICMG, a nonprofit consortium of companies and organizations that collaboratively develop open standards for high performance telecommunications, military, industrial, and general-purpose embedded computing applications. A computer-on-module … Read More
Cautions In Using High-NA EUV
High-NA EUV has received a lot of attention ever since Intel put the spotlight on its receiving the first 0.55 NA EUV tool from ASML [1], expected in 2025. EUV itself has numerous issues which have been enumerated by myself and others, most notoriously the stochastic defects issue. There are also a host of issues related to the propagation… Read More
Arm Shifts Up With SOAFEE
We’re always hearing about shift-left, advances enabling system designers to start various aspects of their development and validation earlier. In support of this goal for automotive developers, Arm recently announced their Scalable Open Architecture for Embedded Edge (SOAFEE). SOAFEE is a software platform (with reference… Read More
WEBINAR: SkillCAD now supports advanced nodes!
Originally containing a handful of commands to help with common layout tasks, SkillCAD has evolved into the industry standard for analog, RF and mixed signal design for customers using Cadence Virtuoso. With over 85 customers worldwide and over 120 functions including the powerful, patented V-editor, metal routing and pin… Read More
The GlobalFoundries IPO March Continues
The GF Technology Summit was last week. It was virtual again this year but with a different format. It was a mix of live and recorded events which did include some cringe worthy moments but all-in-all it was well worth my time.
One of the biggest changes you will notice is the messaging. GF is no longer down in the technology trenches … Read More
LiDAR and the End of the Musk Marketing Masque
One of the key differentiating characteristics of companies working on autonomous vehicles is the willingness to explain or disclose the manner in which this technology works. Tesla and Mobileye have been standouts in the explainer category. Companies like Waymo and Cruise have been less distinguished.
Tesla, though, … Read More
Podcast EP38: Semianalysis on Intel GF TSMC and the Foundry Business
Dan is joined by Dylan Patel of Semianalysis.com covering Intel, GF, TSMC, the semiconductor shortage and more. This is a candid discussion between analysts on current semiconductor events.
The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the… Read More
CEO Interview: Gireesh Rajendran CEO of Steradian Semiconductors
Gireesh Rajendran is a 2010 MIT TR35 winner from India. He holds 44 issued US patents in RF products and circuit techniques and co-authored 3 ISSCC papers. He completed his B Tech in Electronics from College of Engineering, Trivandrum, India in 2000 and joined Texas Instruments. During his 13 years tenure in TI, he architected and… Read More


TSMC CoWoS versus Intel EMIB Semiconductor Packaging