Apple’s iPhone 17 Series 5G mmWave Antenna Module Revealed to be Powered by Soitec FD-SOI SubstratesRecent independent teardown and technical analyses have confirmed…Read More
Advancing Automotive Memory: Development of an 8nm 128Mb Embedded STT-MRAM with Sub-ppm Reliability IEDM 2025 Papers MRAM…Read More
AI Drives Strong Semiconductor Market in 2025-2026The global semiconductor market in 2025 was $792…Read More
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Akeana Partners with Axiomise for Formal Verification of Its Super-Scalar RISC-V CoresAkeana Inc. announced a key milestone in the…Read More
Tuomas Hollman is an experienced senior executive, with proficiency that ranges from strategy to product development and business management. He began his semiconductor industry career at Texas Instruments, serving for 15 years in increasingly important roles, including general management and profit and loss responsibility… Read More
There’s plenty of talk about requirements for IP data management. The fundamental methods to prevent chaos, waste or worse are popular topics. I’ve covered webinars from Cliosoft on the topic on SemiWiki. But what about the future? What’s really needed to set up a path that scales, addressing the challenges of today and the new … Read More
KLA- great quarter driven by continued strong foundry/logic
No supply chain hiccups- Riding high in the cycle
Wafer inspection remains driver with rest along for the ride
Financials remain best in industry
A superb quarter
There was little to complain about in the quarter. Revenues of $2.1B and EPS of $4.64, both nicely beating… Read More
As part of their webinar series, SemiWiki hosted one in June with the title “Five Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC.” The talk by given by Scott Schweitzer, Sr. Manager, Product Planning at Achronix. Scott is a lifelong technology evangelist and focuses on recognizing technology trends and… Read More
The TSMC Open Innovation Platform (OIP) event brings together a wide array of companies reporting cutting edge work that are part of TSMC’s rather substantial ecosystem. The event covers everything from high-performance computing to mobile, automotive, IoT, RF and 3D IC design. Of particular interest for this post is a presentation… Read More
TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum. An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).
Overview of 3D Fabric
The TSMC… Read More
Harry Foster waxes philosophical in a recent white paper from Siemens EDA, in this case on the origins of bugs and the best way to avoid them. Spoiler alert, the answer is not to make them in the first place or at least to flush them out very quickly. I’m not being cynical – that really is the answer though practice often falls short of ideal.… Read More
TSMC recently held their Open Innovation Platform (OIP) Ecosystem Forum event where many of their key partners presented on their latest projects and developments. This year one of their top IP provider partners, Analog Bits, gave two presentations. Analog building blocks have always been necessary as enabling technology … Read More
TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum. An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).
One of the topics that L.C. … Read More
With all the advances in digital technology to serve mankind’s insatiable appetite for automation, it’s easy to lose sight of the reality that we still live in an analog world. It’s easy to take for granted that somewhere in the chain of events that takes place in the process of applying state-of-the-art computational technology… Read More
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An AI-Native Architecture That Eliminates GPU Inefficiencies